Modularized power amplifier devices and architectures
US-2020366259-A1 · Nov 19, 2020 · US
between a chip and a stacked discrete passive device
between a chip and a stacked discrete passive device · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10W90/758 |
| Official title | {between a chip and a stacked discrete passive device} |
| Display label | between a chip and a stacked discrete passive device |
| Total patents | 104 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 9 |
| 2016 | 12 |
| 2017 | 13 |
| 2018 | 14 |
| 2019 | 6 |
| 2020 | 9 |
| 2021 | 8 |
| 2022 | 11 |
| 2023 | 7 |
| 2024 | 9 |
| 2025 | 6 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Integrated Circuit Package Including Miniature Antenna
US-2020295462-A1 · Sep 17, 2020 · US
Semiconductor package with top circuit and an ic with a gap over the ic
US-2020168530-A1 · May 28, 2020 · US
Integrated circuit package including miniature antenna
US-10644405-B2 · May 5, 2020 · US
Resonator device, electronic apparatus, and vehicle
US-10594295-B2 · Mar 17, 2020 · US
IGBT die structure with auxiliary P well terminal
US-10535760-B2 · Jan 14, 2020 · US
Semiconductor package assembly with passive device
US-10497678-B2 · Dec 3, 2019 · US
Method for encasing an electric unit and electrical structural element
US-10390435-B2 · Aug 20, 2019 · US
Integrated circuit package including miniature antenna
US-10320079-B2 · Jun 11, 2019 · US
Semiconductor package
US-10211134-B2 · Feb 19, 2019 · US
Semiconductor device, package, and vehicle
US-10186479-B2 · Jan 22, 2019 · US
Resonator device, electronic apparatus, and vehicle
US-2019007027-A1 · Jan 3, 2019 · US
Integrated Circuit Package Including Miniature Antenna
US-2018331427-A1 · Nov 15, 2018 · US
Sensorless temperature compensation for power switching devices
US-10122357-B2 · Nov 6, 2018 · US
Electronic package with antenna structure
US-10074621-B2 · Sep 11, 2018 · US
Signal isolator integrated circuit package
US-10074713-B1 · Sep 11, 2018 · US
Integrated circuit package including miniature antenna
US-10056691-B2 · Aug 21, 2018 · US
Method for encasing an electric unit and electrical structural element
US-2018177053-A1 · Jun 21, 2018 · US
IGBT Die Structure With Auxiliary P Well Terminal
US-2018145162-A1 · May 24, 2018 · US
Sensorless temperature compensation for power switching devices
US-2018138902-A1 · May 17, 2018 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10W90/758?
- CPC H10W90/758 is the Cooperative Patent Classification code for “between a chip and a stacked discrete passive device.”
- How many patents are filed under CPC H10W90/758 (between a chip and a stacked discrete passive device)?
- Our database includes 104 publications tagged with this CPC code.
- Is patent activity under CPC H10W90/758 growing?
- Publication counts under this code: 9 in 2024 vs 6 in 2025 (latest complete years).