Cover apparatus for optimal beam implementation for antenna in wireless communication system
US-12183969-B2 · Dec 31, 2024 · US
Electronic package with antenna structure
US10074621B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10074621-B2 |
| Application number | US-201615181489-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 14, 2016 |
| Priority date | Mar 28, 2016 |
| Publication date | Sep 11, 2018 |
| Grant date | Sep 11, 2018 |
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- Title
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- Abstract
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- Assignees and inventors
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- First independent claim
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- CPC / IPC classifications
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Abstract
Official abstract text for this publication.
Provided is an electronic package, including: a carrier, an electronic component disposed on the carrier, and an antenna structure, wherein the antenna structure has a plurality of spacing members and at least one wire connected among the spacing members. No additional layout area is required to be formed on a surface of the carrier, such that the objective of miniaturization can be achieved.
First claim
Opening claim text (preview).
What is claimed is: 1. An electronic package, comprising: a carrier; at least one electronic component disposed on the carrier; at least one antenna structure disposed on the carrier and consisting of a plurality of spacing members and at least one wire, wherein the wire connects any two adjacent ones of the spacing members, and each of the spacing members has at least one conductive pad connected with the wire; and an encapsulating layer formed on the carrier and encapsulating the electronic component and a portion of the antenna structure, wherein at least one of the spacing members is exposed from the encapsulating layer. 2. The electronic package of claim 1 , wherein the electronic component is electrically connected with the carrier. 3. The electronic package of claim 1 , wherein one of the spacing members is disposed on the carrier. 4. The electronic package of claim 1 , wherein one of the spacing members is electrically connected with the electronic component through another wire. 5. The electronic package of claim 1 , wherein one of the spacing members includes at least one conductive pillar electrically connected with the carrier. 6. The electronic package of claim 1 , wherein one of the spacing members is electrically connected with the carrier through another wire. 7. The electronic package of claim 1 , further comprising a passive element disposed on the carrier. 8. The electronic package of claim 7 , wherein the passive element is electrically connected with one of the spacing members through another wire. 9. The electronic package of claim 7 , wherein the passive element is electrically connected with the electronic component through another wire. 10. The electronic package of claim 1 , wherein one of the spacing members is disposed on the electronic component.
Assignees
Inventors
Classifications
- H01Q1/243Primary
with built-in antennas · CPC title
between a chip and a laterally-adjacent discrete passive device · CPC title
between a chip and a stacked discrete passive device · CPC title
between a chip and a stacked insulating package substrate, interposer or RDL · CPC title
between a chip and a stacked insulating package substrate, interposer or RDL · CPC title
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Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US10074621B2 cover?
- Provided is an electronic package, including: a carrier, an electronic component disposed on the carrier, and an antenna structure, wherein the antenna structure has a plurality of spacing members and at least one wire connected among the spacing members. No additional layout area is required to be formed on a surface of the carrier, such that the objective of miniaturization can be achieved.
- Who is the assignee on this patent?
- Siliconware Precision Industries Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification H01Q1/243. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Sep 11 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).