Direct cooling type power module
US-2023360996-A1 · Nov 9, 2023 · US
Liquid fillings
Liquid fillings · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10W76/45 |
| Official title | Liquid fillings |
| Display label | Liquid fillings |
| Total patents | 69 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 4 |
| 2016 | 7 |
| 2018 | 4 |
| 2019 | 8 |
| 2020 | 13 |
| 2021 | 6 |
| 2022 | 8 |
| 2023 | 10 |
| 2024 | 4 |
| 2025 | 3 |
| 2026 | 2 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Semiconductor Module with Liquid Dielectric Encapsulant
US-2023360989-A1 · Nov 9, 2023 · US
Technologies for liquid metal mixtures for electrical interconnects
US-2023317533-A1 · Oct 5, 2023 · US
Semiconductor package device
US-11735491-B2 · Aug 22, 2023 · US
Low force liquid metal interconnect solutions
US-2023209759-A1 · Jun 29, 2023 · US
Electronic device and method of manufacturing an electronic device
US-11670570-B2 · Jun 6, 2023 · US
Low force liquid metal interconnect solutions
US-11622466-B2 · Apr 4, 2023 · US
Cooling of conformal power delivery structures
US-2023098020-A1 · Mar 30, 2023 · US
Dam surrounding a die on a substrate
US-2023086920-A1 · Mar 23, 2023 · US
Crack identification in IC chip package using encapsulated liquid penetrant contrast agent
US-11543322-B2 · Jan 3, 2023 · US
Power electronics assemblies with CIO bonding layers and double sided cooling, and vehicles incorporating the same
US-11527458-B2 · Dec 13, 2022 · US
Heat dissipation structure, production method thereof, chip structure, and electronic device
US-2022344237-A1 · Oct 27, 2022 · US
Semiconductor package device
US-2022301969-A1 · Sep 22, 2022 · US
Thermal management solutions for embedded integrated circuit devices
US-11342243-B2 · May 24, 2022 · US
Packaged electronic devices with top terminations
US-11343919-B2 · May 24, 2022 · US
Ceramic package
US-11309135-B2 · Apr 19, 2022 · US
Power Semiconductor Module Arrangement and Method for Producing the Same
US-2022051960-A1 · Feb 17, 2022 · US
Packaging cover plate, organic light-emitting diode display and manufacturing method therefor
US-11245099-B2 · Feb 8, 2022 · US
Low force liquid metal interconnect solutions
US-2021392774-A1 · Dec 16, 2021 · US
Crack identification in ic chip package using encapsulated liquid penetrant contrast agent
US-2021341349-A1 · Nov 4, 2021 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10W76/45?
- CPC H10W76/45 is the Cooperative Patent Classification code for “Liquid fillings.”
- How many patents are filed under CPC H10W76/45 (Liquid fillings)?
- Our database includes 69 publications tagged with this CPC code.
- Is patent activity under CPC H10W76/45 growing?
- Publication counts under this code: 4 in 2024 vs 3 in 2025 (latest complete years).