Packaging cover plate, organic light-emitting diode display and manufacturing method therefor

Patent metadata

Field	Value
Publication number	US-11245099-B2
Application number	US-201816319576-A
Country	US
Kind code	B2
Filing date	May 11, 2018
Priority date	Jun 26, 2017
Publication date	Feb 8, 2022
Grant date	Feb 8, 2022

Abstract

Disclosed are a packaging cover plate, an organic light-emitting diode display and a manufacturing method therefor. The packaging cover plate comprises: a cover plate body, the cover plate body being provided with open slots; cover plugs for covering openings at two ends of the open slots; and water absorption layers for at least covering mouths of the open slots. By means of the arranged open slots, the packaging cover plate can conveniently introduce a dry gas. In addition, the water absorption layers absorb water vapour, the introduced dry gas dries the water absorption layers, and the water vapour and oxygen in the water absorption layers can be taken away by means of the circular flow of the dry gas, so that damage to a device by water vapour and oxygen can be reduced, and the packaging effect is better.

First claim

The invention claimed is:

1. An encapsulating cover plate, comprising:
a cover plate body, having an open groove; wherein the open groove is provided with two openings at two ends of the open groove; when the two openings are in an open state, drying gas is in circulation flow in the open groove by entering in one of the two openings and flowing out of another one of the two openings;
cap plugs, configured for covering the two openings of the open groove; wherein the two openings are in a close state after being covered by the cap plugs; when the two openings are in the close state, the open groove is filled with liquid metal, and when the two openings are in the open state, the liquid metal is sucked out of the open groove; and
a water absorption layer, configured for covering at least an open of the open groove and for absorbing water vapor coming from outside to a device encapsulated by the encapsulating cover plate.

2. The encapsulating cover plate according to claim 1 , further comprising a chemical drying agent doped in the water absorption layer, wherein the chemical drying agent changes color when absorbing water.

3. The encapsulating cover plate according to claim 2 , wherein the chemical drying agent comprises any one of copper sulfate and silica gel.

4. The encapsulating cover plate according to claim 1 , wherein the water absorption layer is a water absorption layer made of an organic material.

5. The encapsulating cover plate according to claim 1 , wherein the open groove is of a fold line shape.

6. The encapsulating cover plate according to claim 5 , wherein the open groove comprises:
a plurality of first strip-shaped grooves spaced apart along a first direction of the cover plate body, wherein a first strip-shaped groove at a first position in an arranging direction and a first strip-shaped groove at a last position in the arranging direction having the two openings, respectively; and
a second strip-shaped groove for connecting two adjacent first strip-shaped grooves, the second strip-shaped groove having a length direction perpendicular to the first direction.

7. The encapsulating cover plate according to claim 1 , wherein the water absorption layer covers only the open of the open groove.

8. The encapsulating cover plate according to claim 1 , wherein the water absorption layer covers one surface of the cover plate body, provided with the open groove.

9. An organic light-emitting diode display, comprising: a substrate having an organic light-emitting diode device, and further comprising: the encapsulating cover plate according to claim 1 , the encapsulating cover plate is configured to encapsulate the organic light-emitting diode device.

10. A fabricating method of an organic light-emitting diode display, comprising:
providing a substrate on which an organic light-emitting diode device is formed;
providing a cover plate body;
forming an open groove in the cover plate body;
sealing both ends of the open groove by cap plugs;
forming a water absorption layer for covering at least an open of the open groove and for absorbing water vapor coming from outside to the organic light-emitting diode device;
forming a sealant on the water absorption layer; and
sealing and pressing the cover plate on which the sealant is formed and the substrate on which the organic light-emitting diode device is formed;
wherein the open groove is provided with two openings at the both ends of the open groove; the two openings are in a close state after being sealed by the cap plugs; and the two openings are in an open state if the cap plugs are pulled out from the openings;
when the two openings are in the open state, drying gas is in circulation flow in the open groove by entering in one of the two openings and flowing out of another one of the two openings;
when the two openings are in the close state, the open groove is filled with liquid metal, and when the two openings are in the open state, the liquid metal is sucked out of the open groove.

Assignees

• Boe Technology Group Co Ltd

Inventors

• Wang Linlin

Classifications

• H10W76/05

  Providing fillings in containers, e.g. gas filling · CPC title

• H10W74/01

  Manufacture or treatment · CPC title

• H10W76/48

  Fillings including materials for absorbing or reacting with moisture or other undesired substances · CPC title

• H10W76/45

  Liquid fillings · CPC title

• H10W76/43

  Gaseous fillings · CPC title