Package-on-package structure
US-10867849-B2 · Dec 15, 2020 · US
comprising semiconductor materials
comprising semiconductor materials · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10W74/481 |
| Official title | {comprising semiconductor materials} |
| Display label | comprising semiconductor materials |
| Total patents | 134 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2016 | 5 |
| 2017 | 10 |
| 2018 | 14 |
| 2019 | 13 |
| 2020 | 22 |
| 2021 | 13 |
| 2022 | 10 |
| 2023 | 10 |
| 2024 | 14 |
| 2025 | 11 |
| 2026 | 12 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Internally-shielded microelectronic packages and methods for the fabrication thereof
US-10861774-B2 · Dec 8, 2020 · US
Castellated superjunction transistors
US-2020373384-A1 · Nov 26, 2020 · US
Semiconductor package with floating heat spreader and process for making the same
US-2020343157-A1 · Oct 29, 2020 · US
Semiconductor device
US-2020343173-A1 · Oct 29, 2020 · US
Semiconductor package with floating heat spreader and process for making the same
US-10734301-B2 · Aug 4, 2020 · US
Lateral bipolar junction transistor with abrupt junction and compound buried oxide
US-10727299-B2 · Jul 28, 2020 · US
Castellated superjunction transistors
US-2020235202-A1 · Jul 23, 2020 · US
Internally-shielded microelectronic packages and methods for the fabrication thereof
US-2020211932-A1 · Jul 2, 2020 · US
Semiconductor chip package with spring biased lid
US-2020185294-A1 · Jun 11, 2020 · US
Stack packages relating to bridge die
US-2020176385-A1 · Jun 4, 2020 · US
Package-on-package structure
US-2020144110-A1 · May 7, 2020 · US
Interconnect structures
US-2020126906-A1 · Apr 23, 2020 · US
Internally-shielded microelectronic packages and methods for the fabrication thereof
US-10629518-B2 · Apr 21, 2020 · US
Semiconductor package with floating heat spreader and process for making the same
US-2020083136-A1 · Mar 12, 2020 · US
Internally-shielded microelectronic packages and methods for the fabrication thereof
US-2020075463-A1 · Mar 5, 2020 · US
Semiconductor device having a three-sided textured substrate
US-10573603-B2 · Feb 25, 2020 · US
Package-on-package structure and method of manufacturing package
US-2020006133-A1 · Jan 2, 2020 · US
Semiconductor device for use in harsh media
US-2019385922-A1 · Dec 19, 2019 · US
Package-on-package structure and method of manufacturing package
US-10510591-B1 · Dec 17, 2019 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10W74/481?
- CPC H10W74/481 is the Cooperative Patent Classification code for “comprising semiconductor materials.”
- How many patents are filed under CPC H10W74/481 (comprising semiconductor materials)?
- Our database includes 134 publications tagged with this CPC code.
- Is patent activity under CPC H10W74/481 growing?
- Publication counts under this code: 14 in 2024 vs 11 in 2025 (latest complete years).