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of outermost layers of multilayered die-attach connectors, e.g. material of a coating
of outermost layers of multilayered die-attach connectors, e.g. material of a coating · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10W72/355 |
| Official title | {of outermost layers of multilayered die-attach connectors, e.g. material of a coating} |
| Display label | of outermost layers of multilayered die-attach connectors, e.g. material of a coating |
| Total patents | 255 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is growing.
| Year | Patents |
|---|---|
| 2015 | 14 |
| 2016 | 24 |
| 2017 | 23 |
| 2018 | 15 |
| 2019 | 23 |
| 2020 | 21 |
| 2021 | 22 |
| 2022 | 32 |
| 2023 | 20 |
| 2024 | 28 |
| 2025 | 28 |
| 2026 | 5 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Power module
US-2017352629-A1 · Dec 7, 2017 · US
Anisotropic conductive material, electronic device including anisotropic conductive material, and method of manufacturing electronic device
US-9831211-B2 · Nov 28, 2017 · US
Semiconductor device and method for manufacturing the same
US-2017316997-A1 · Nov 2, 2017 · US
Pre-plated substrate for die attachment
US-2017294393-A1 · Oct 12, 2017 · US
Sinterable bonding material and semiconductor device using the same
US-2017294404-A1 · Oct 12, 2017 · US
Adhesive sheet, method for manufacturing semiconductor device using same, method for manufacturing thermal airflow sensor using same, and thermal airflow sensor
US-9779976-B2 · Oct 3, 2017 · US
Printed adhesion deposition to mitigate integrated circuit delamination
US-2017271174-A1 · Sep 21, 2017 · US
Circuit carrier including a silicone polymer coating
US-9754850-B2 · Sep 5, 2017 · US
Method for connecting components by pressure sintering
US-2017239728-A1 · Aug 24, 2017 · US
Conductive composition and electronic parts using the same
US-2017243849-A1 · Aug 24, 2017 · US
Method for producing member for semiconductor device and semiconductor device, and member for semiconductor device
US-2017207187-A1 · Jul 20, 2017 · US
Semiconductor device having insulating layers containing oxygen and a barrier layer containing manganese
US-9704740-B2 · Jul 11, 2017 · US
Printed adhesion deposition to mitigate integrated circuit delamination
US-2017194170-A1 · Jul 6, 2017 · US
Liquid resin composition, die attaching method using same and semiconductor device having cured product of same
US-2017158926-A1 · Jun 8, 2017 · US
Semiconductor packages with an intermetallic layer
US-2017133341-A1 · May 11, 2017 · US
Method for manufacturing semiconductor device
US-9627350-B2 · Apr 18, 2017 · US
Power semiconductor package with conductive clips
US-9620471-B2 · Apr 11, 2017 · US
Conductive particle and preparation method thereof, conductive adhesive and display device
US-2017088752-A1 · Mar 30, 2017 · US
Electronic devices with semiconductor die coupled to a thermally conductive substrate
US-9589860-B2 · Mar 7, 2017 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10W72/355?
- CPC H10W72/355 is the Cooperative Patent Classification code for “of outermost layers of multilayered die-attach connectors, e.g. material of a coating.”
- How many patents are filed under CPC H10W72/355 (of outermost layers of multilayered die-attach connectors, e.g. material of a coating)?
- Our database includes 255 publications tagged with this CPC code.
- Is patent activity under CPC H10W72/355 growing?
- Publication counts under this code: 28 in 2024 vs 28 in 2025 (latest complete years).