Adhesive sheet, method for manufacturing semiconductor device using same, method for manufacturing thermal airflow sensor using same, and thermal airflow sensor

Patent metadata

Field	Value
Publication number	US-9779976-B2
Application number	US-201414896084-A
Country	US
Kind code	B2
Filing date	Apr 18, 2014
Priority date	Jun 13, 2013
Publication date	Oct 3, 2017
Grant date	Oct 3, 2017

Abstract

Provided is a thermal type airflow volume meter improving measurement accuracy, a method for manufacturing the same, and an adhesive sheet for use therein, the adhesive sheet divided into at least two or more per adherend and having a thickness of approximately 0.1 mm or less is divided to correspond to a shape of the adherend and generates or increases adhesion or stickiness by external energy.

First claim

The invention claimed is:

1. A method for manufacturing a semiconductor device at least including a process of dicing a semiconductor element wafer with use of a dicing machine for use in processing the semiconductor element wafer, the semiconductor element wafer having a diaphragm provided by processing a semiconductor substrate and provided with a dicing tape to which an adhesive sheet is stuck, the method comprising:
a process of dividing the adhesive sheet on the dicing tape to which the adhesive sheet is stuck with use of slitting by the dicing machine before the adhesive sheet is stuck to the semiconductor element wafer;
a pickup process of picking up a diced semiconductor element; and
a process of forming a ventilation hole in the adhesive sheet after the pickup process.

2. The method for manufacturing a semiconductor device according to claim 1 , wherein the adhesive sheet is provided with the polygonal ventilation hole having at least three sides.

3. The method for manufacturing a semiconductor device according to claim 1 , wherein a maximum dimension of the ventilation hole formed in the adhesive sheet is smaller than a diaphragm back surface opening dimension on a back surface of the semiconductor element.

4. The method for manufacturing a semiconductor device according to claim 2 , wherein the adhesive sheet is provided with a slit on an extended line of each of the sides of the formed polygonal ventilation hole.

5. A method for manufacturing a thermal type airflow volume sensor at least including a process of dicing a semiconductor element wafer into respective flow volume detection elements with use of a dicing machine for use in processing the semiconductor element wafer, the semiconductor element wafer including the plurality of flow volume detection elements each having a diaphragm provided by processing a semiconductor substrate and each including on the diaphragm a heat generation resistor and temperature measurement resistors respectively provided on an upstream side and a downstream side of airflow with respect to the heat generation resistor and provided with a dicing tape to which an adhesive sheet is stuck, the method comprising:
a process of dividing the adhesive sheet on the dicing tape to which the adhesive sheet is stuck with use of slitting by the dicing machine before the adhesive sheet is stuck to the semiconductor element wafer;
a pickup process of picking up the diced flow volume detection element; and
a process of mounting the picked up flow volume detection element on a support member having a communication hole.

6. The method for manufacturing a thermal type airflow volume sensor according to claim 5 , wherein the support member includes a lead frame.

7. A thermal type airflow volume sensor produced in the method for manufacturing a thermal type airflow volume sensor according to claim 5 , wherein
the communication hole of the support member is provided to open one side of a cavity provided on a side of a back surface of the diaphragm,
the adhesive sheet has a ventilation hole formed to cause an area of the cavity of the back surface of the diaphragm and an opening area of the communication hole of the support member to communicate with each other, and
the area of the cavity of the back surface of the diaphragm is provided with a slit of the adhesive sheet.

Assignees

• Hitachi Automotive Systems Ltd

Inventors

• IKEO Satoshi
• Sagawa Toshifumi
• Doi Ryosuke
• Kikuchi Hiroshi
• Mukuno Hideki

Classifications

• H10W72/5522

  comprising gold [Au] · CPC title

• H10W74/10

  characterised by their shape or disposition · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W72/932

  Plan-view shape, i.e. in top view · CPC title