Wafer-level package including under bump metal layer
US-11862589-B2 · Jan 2, 2024 · US
Apparatus for manufacturing bump connectors
Apparatus for manufacturing bump connectors · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10W72/0112 |
| Official title | {Apparatus for manufacturing bump connectors} |
| Display label | Apparatus for manufacturing bump connectors |
| Total patents | 315 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 30 |
| 2016 | 32 |
| 2017 | 27 |
| 2018 | 45 |
| 2019 | 23 |
| 2020 | 34 |
| 2021 | 32 |
| 2022 | 30 |
| 2023 | 26 |
| 2024 | 14 |
| 2025 | 20 |
| 2026 | 2 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Magnetic intermetallic compound interconnect
US-2016379951-A9 · Dec 29, 2016 · US
Solder bump forming method and apparatus
US-9511438-B2 · Dec 6, 2016 · US
Electronic component-mounted structure, IC card and COF package
US-9516749-B2 · Dec 6, 2016 · US
Fabricating pillar solder bump
US-9508594-B2 · Nov 29, 2016 · US
Electrochemical deposition method
US-9506162-B2 · Nov 29, 2016 · US
Assembly bonding
US-9488853-B2 · Nov 8, 2016 · US
Electrochemical deposition method
US-2016319454-A1 · Nov 3, 2016 · US
Electrochemical deposition method
US-2016319456-A1 · Nov 3, 2016 · US
Electrochemical deposition method
US-2016319455-A1 · Nov 3, 2016 · US
Conductive connections, structures with such connections, and methods of manufacture
US-9437566-B2 · Sep 6, 2016 · US
Low alpha tin
US-9425164-B1 · Aug 23, 2016 · US
Antioxidant gas blow-off unit
US-9415456-B2 · Aug 16, 2016 · US
Electrochemical deposition method
US-9388505-B2 · Jul 12, 2016 · US
Electromigration-resistant lead-free solder interconnect structures
US-9379007-B2 · Jun 28, 2016 · US
Magnetic intermetallic compound interconnect
US-2016172320-A1 · Jun 16, 2016 · US
Electroless plating apparatus
US-2016160352-A1 · Jun 9, 2016 · US
Antioxidant gas blow-off unit
US-9362251-B2 · Jun 7, 2016 · US
Through silicon vias and thermocompression bonding using inkjet-printed nanoparticles
US-2016148840-A1 · May 26, 2016 · US
Metal Post Bonding Using Pre-Fabricated Metal Posts
US-2016143157-A1 · May 19, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10W72/0112?
- CPC H10W72/0112 is the Cooperative Patent Classification code for “Apparatus for manufacturing bump connectors.”
- How many patents are filed under CPC H10W72/0112 (Apparatus for manufacturing bump connectors)?
- Our database includes 315 publications tagged with this CPC code.
- Is patent activity under CPC H10W72/0112 growing?
- Publication counts under this code: 14 in 2024 vs 20 in 2025 (latest complete years).