Electroplating systems and methods for high sheet resistance substrates
US-9222195-B2 · Dec 29, 2015 · US
Electrochemical deposition method
US9506162B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9506162-B2 |
| Application number | US-201615180448-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 13, 2016 |
| Priority date | Jun 21, 2002 |
| Publication date | Nov 29, 2016 |
| Grant date | Nov 29, 2016 |
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Abstract
Official abstract text for this publication.
The present invention is to provide a substrate holder which can effect a more complete sealing with a sealing member and makes it possible to take a substrate out of the substrate holder easily and securely, and also a plating apparatus provided with the substrate holder. The substrate holder includes: a fixed holding member and a movable holding member for holding a substrate therebetween; a sealing member mounted to the fixed holding member or the movable holding member; and a suction pad for attracting a back surface of the substrate held between the fixed holding member and the movable holding member.
First claim
Opening claim text (preview).
The invention claimed is: 1. A substrate holder for detachably holding a substrate having a surface to be electroplated, said substrate holder comprising: a fixed holding member and a movable holding member for holding a substrate therebetween, the movable holding member having a seal portion for sealing an area surrounding a peripheral edge of the substrate when the movable holding member is pressed against the fixed holding member; and a springy leaf spring member, mounted to…
Assignees
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Classifications
Chemistry & Metallurgy · mapped topic
Chemistry & Metallurgy · mapped topic
- C25D17/001Primary
Chemistry & Metallurgy · mapped topic
Chemistry & Metallurgy · mapped topic
Chemistry & Metallurgy · mapped topic
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- What does patent US9506162B2 cover?
- The present invention is to provide a substrate holder which can effect a more complete sealing with a sealing member and makes it possible to take a substrate out of the substrate holder easily and securely, and also a plating apparatus provided with the substrate holder. The substrate holder includes: a fixed holding member and a movable holding member for holding a substrate therebetween; a …
- Who is the assignee on this patent?
- Ebara Corp
- What technology area does this patent fall under?
- Primary CPC classification C25D17/001. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue Nov 29 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).