Low alpha tin

Patent metadata

Field	Value
Publication number	US-9425164-B1
Application number	US-201514950852-A
Country	US
Kind code	B1
Filing date	Nov 24, 2015
Priority date	Nov 24, 2015
Publication date	Aug 23, 2016
Grant date	Aug 23, 2016

Abstract

A non alpha controlled Tin including Tin and a trace amount of Polonium may be converted to a low alpha emission Tin by concentrating and removing at least some of the Polonium. The non alpha controlled Tin may be a raw material or a solder bump upon a semiconductor wafer, chip, or carrier. The Polonium may be concentrated by oxidizing an exterior portion of the non alpha controlled Tin. If the non alpha controlled Tin is a raw material, the oxidized exterior portion of the non alpha controlled Tin may be stripped. If the non alpha controlled Tin is a solder bump, the oxidized exterior portion of the solder bump may be removed by applying flux to the solder bump, reflowing the solder bump to dissolve the oxidized exterior portion and the concentrated Po into the flux, and cleaning the flux from the solder bump.

First claim

What is claimed is:

1. A method of forming low alpha Tin (Sn) from uncontrolled alpha Sn including Sn and a trace amount of Polonium (Po), the method comprising:
concentrating the Po within the uncontrolled alpha Sn, and;
removing the concentrated Po.

2. The method of claim 1 , wherein concentrating the Po within the uncontrolled alpha Sn further comprises:
oxidizing an exterior portion of the uncontrolled alpha Sn.

3. The method of claim 2 , wherein the Po is concentrated in the oxidized exterior portion.

4. The method of claim 2 , wherein oxidizing the exterior portion of the uncontrolled alpha Sn further comprises:
heating the uncontrolled alpha Sn in air at a temperature below the melting point of Sn.

5. The method of claim 3 , wherein removing the concentrated Po further comprises:
removing the oxidized exterior portion from the uncontrolled alpha Sn.

6. The method of claim 5 , wherein upon removal of the oxidized exterior portion, the uncontrolled alpha Sn becomes a low alpha Sn.

7. The method of claim 6 wherein the low alpha Sn has an alpha emission rate less than 2 α/cm 2 /1000 hours.

8. A method of reducing alpha particle emission from a semiconductor device comprising a solder bump including Tin (Sn) and a trace amount of Polonium (Po), the method comprising:
concentrating the Po within the solder bump, and;
removing the concentrated Po.

9. The method of claim 8 , wherein concentrating the Po within the solder bump further comprises:
oxidizing an exterior portion of the solder bump.

10. The method of claim 9 , wherein the Po is concentrated in the oxidized exterior portion.

11. The method of claim 9 , wherein oxidizing the exterior portion of the solder bump further comprises:
heating the semiconductor device in air at a temperature below the melting point of Sn.

12. The method of claim 11 , wherein removing the concentrated Po further comprises:
removing the oxidized exterior portion from the solder bump by applying flux to the solder bump, reflowing the solder bump to dissolve the oxidized exterior portion and the concentrated Po into the flux, and cleaning the flux from the solder bump.

13. The method of claim 12 , wherein upon removal of the oxidized exterior portion, the solder bump is a low alpha solder bump.

14. The method of claim 13 , wherein the low alpha solder bump has an alpha particle emission rate less than 2 α/cm 2 /1000 hours.

15. A method of reducing alpha emission from a semiconductor chip carrier comprising a solder bump including Tin (Sn) and a trace amount of Polonium (Po), the method comprising:
concentrating the Po within the solder bump, and;
removing the concentrated Po.

16. The method of claim 15 , wherein concentrating the Po within the solder bump further comprises:
oxidizing an exterior portion of the solder bump.

17. The method of claim 15 , wherein the Po is concentrated in the oxidized exterior portion.

18. The method of claim 16 , wherein oxidizing the exterior portion of the solder bump further comprises:
heating the semiconductor device in air at a temperature below the melting point of Sn.

19. The method of claim 17 , wherein removing the concentrated Po further comprises:
removing the oxidized exterior portion from the solder bump by applying flux to the solder bump, reflowing the solder bump to dissolve the oxidized exterior portion and the concentrated Po into the flux, and cleaning the flux from the solder bump.

20. The method of claim 19 , wherein upon removal of the oxidized exterior portion, the solder bump is a low alpha solder bump having an alpha particle emission rate less than 2 α/cm 2 /1000 hours.

Assignees

• IBM

Inventors

• Arvin Charles L
• Gordon Michael S

Classifications

• H10P95/90

  Thermal treatments, e.g. annealing or sintering · CPC title

• H10W72/07211

  Treating the bond pad before connecting, e.g. by applying flux or cleaning · CPC title

• H10W72/01971

  Cleaning, e.g. oxide removal · CPC title

• H10W72/01953

  by etching · CPC title

• H10W72/01271

  Cleaning, e.g. oxide removal or de-smearing · CPC title