Method for producing flexible display panel

Patent metadata

Field	Value
Publication number	US-2016248012-A1
Application number	US-201414762183-A
Country	US
Kind code	A1
Filing date	Sep 18, 2014
Priority date	Jun 12, 2014
Publication date	Aug 25, 2016
Grant date	—

Abstract

An embodiment of the present invention provides a method for producing a flexible display panel. The method includes the following steps of: providing a bearing substrate and a transparent substrate arranged with the flexible display panel; setting a laser irradiation path and irradiating the bearing substrate by using a laser along the set laser irradiation path to form a mark region on the bearing substrate; placing the flexible display panel on the mark region correspondingly; irradiating from a side of the transparent substrate by re-using the laser along the set laser irradiation path, to peel off the flexible display panel from the transparent substrate; and separating the flexible display panel from the mark region on the bearing substrate to obtain the flexible display panel.

First claim

1 . A method for producing a flexible display panel, comprising:
providing a bearing substrate and a transparent substrate arranged with the flexible display panel; setting a laser irradiation path and irradiating the bearing substrate by using a laser along the set laser irradiation path to form a mark region on the bearing substrate; placing the flexible display panel on the mark region correspondingly; irradiating from a side of the transparent substrate by re-using the laser along the set laser irradiation path, to peel off the flexible display panel from the transparent substrate; and separating the flexible display panel from the mark region on the bearing substrate to obtain the flexible display panel.

2 . The method according to claim 1 , wherein the bearing substrate is provided with a layer of amorphous silicon thereon.

3 . The method according to claim 2 , wherein the step of irradiating the bearing substrate by using a laser along the set laser irradiation path further comprises: irradiating a partial region of the layer of amorphous silicon by using a laser along the set laser irradiation path to form a polycrystalline silicon region as the mark region.

4 . The method according to claim 1 , wherein the mark region has an area greater than or equal to an area of the flexible display panel such that the flexible display panel is located completely within a border range of the mark region.

5 . The method according to claim 1 , wherein the flexible display panel and the transparent substrate have shapes corresponding to each other completely and are aligned with each other, and the transparent substrate and the flexible display panel have areas equal to each other or substantially equal to each other.

6 . The method according to claim 1 , further comprising a step of connecting the flexible display panel to a flexible circuit board outside the transparent substrate.

7 . The method according to claim 6 , wherein the flexible circuit board has a longitudinal direction perpendicular to an edge of the flexible display panel connected to the flexible circuit board or parallel to the edge or inclined with respect to the edge at an angle.

8 . The method according to claim 6 , further comprising a step of fixing the flexible circuit board on the bearing substrate.

9 . The method according to claim 6 , wherein the step of fixing the flexible circuit board on the bearing substrate further comprises adhesively fixing the flexible circuit board on a region on the bearing substrate other than the mark region by a high temperature adhesive tape or a double-sided adhesive tape.

10 . The method according to claim 6 , wherein an edge of the flexible display panel connected to the flexible circuit board is aligned with a corresponding edge of the mark region or projects outside the mark region.

11 . The method according to claim 10 , wherein the edge of the flexible display panel projects outside the mark region by a distance in a range of 0-10 millimeters.

12 . The method according to claim 11 , wherein the edge of the flexible display panel projects outside the mark region by a distance in a range of 0-1 millimeter.

13 . The method according to claim 1 , wherein the step of placing the flexible display panel on the mark region correspondingly further comprises:
placing flexible display panels on one or a plurality of transparent substrates side by side, on at least one mark region correspondingly.

14 . The method according to claim 1 , wherein the mark region has a shape of rectangle, square, ellipse, circle or triangle or has another suitable shape.

15 . The method according to claim 13 , wherein the plurality of transparent substrates provided with flexible display panels are obtained by cutting a plurality of flexible display panels on a layer of flexible material formed on the same transparent substrate.

16 . The method according to claim 1 , wherein the set laser irradiation path is a path extending from a weld side of the flexible display panel connected to the flexible circuit board to an opposed side to this weld side, a path perpendicular to this extending path or a path inclined at an angle with respect to this extending path.

17 . The method according to claim 1 , wherein the transparent substrate is a glass substrate.

18 . The method according to claim 1 , wherein the laser is produced from an excimer laser source.

19 . The method according to claim 2 , wherein the mark region has an area greater than or equal to the area of the flexible display panel such that the flexible display panel is located completely within a border range of the mark region.

20 . The method according to claim 19 , wherein the flexible display panel and the transparent substrate have shapes corresponding to each other and are aligned with each other, and the transparent substrate and the flexible display panel have areas equal to each other or substantially equal to each other.

Assignees

• Boe Technology Group Co Ltd

Inventors

• Ren Qingrong
• Guo Wei

Classifications

• H10P95/112

  leaving a reusable substrate, e.g. epitaxial lift off · CPC title

• H10P72/57 Primary

  Mask-wafer alignment · CPC title

• H10D86/0214

  using temporary substrates · CPC title

• H10D86/60

  wherein the TFTs are in active matrices · CPC title

• H10D86/40

  characterised by multiple TFTs · CPC title