Hybrid electro-optically controlled matrix-addressed systems
US-2024322063-A1 · Sep 26, 2024 · US
formed in, or on, a common substrate
formed in, or on, a common substrate · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10F55/155 |
| Official title | formed in, or on, a common substrate |
| Display label | formed in, or on, a common substrate |
| Total patents | 175 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly declining.
| Year | Patents |
|---|---|
| 2015 | 6 |
| 2016 | 23 |
| 2017 | 13 |
| 2018 | 26 |
| 2019 | 27 |
| 2020 | 23 |
| 2021 | 18 |
| 2022 | 18 |
| 2023 | 7 |
| 2024 | 6 |
| 2025 | 7 |
| 2026 | 1 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Display panel, display device and method for making the same
US-10136089-B2 · Nov 20, 2018 · US
Glue bleeding prevention cap for optical sensor packages
US-2018331236-A1 · Nov 15, 2018 · US
Display panel, method of manufacturing display panel, and display device
US-2018329247-A1 · Nov 15, 2018 · US
Monolithically integrated high voltage photovoltaics and light emitting diode with textured surface
US-2018301587-A1 · Oct 18, 2018 · US
High voltage photovoltaics integrated with light emitting diode containing zinc oxide containing layer
US-2018277704-A1 · Sep 27, 2018 · US
High voltage photovoltaics integrated with light emitting diode containing zinc oxide containing layer
US-2018277705-A1 · Sep 27, 2018 · US
Stacked optocoupler component
US-10050169-B2 · Aug 14, 2018 · US
Method of producing an optical sensor at wafer-level and optical sensor
US-2018226514-A1 · Aug 9, 2018 · US
Glue bleeding prevention cap for optical sensor packages
US-10038108-B2 · Jul 31, 2018 · US
Silicon photonics integration method and structure
US-10026852-B2 · Jul 17, 2018 · US
Method of forming an integrated circuit and related integrated circuit
US-2018172903-A1 · Jun 21, 2018 · US
Glue bleeding prevention cap for optical sensor packages
US-2018062003-A1 · Mar 1, 2018 · US
Photosensor and display device including the same
US-9899558-B2 · Feb 20, 2018 · US
Light emitting element
US-2018019362-A1 · Jan 18, 2018 · US
Display panel and display device
US-2018019288-A1 · Jan 18, 2018 · US
Photoelectric conversion device, imaging element, and imaging device
US-2018019363-A1 · Jan 18, 2018 · US
Image capture device with integrated illumination and method for producing the device
US-9865764-B2 · Jan 9, 2018 · US
Electroluminescent device with integrated sensor and method for controlling the emission of the device
US-9847446-B2 · Dec 19, 2017 · US
Semiconductor device comprising an emitter of radiation and a photosensor and appertaining production method
US-9842946-B2 · Dec 12, 2017 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10F55/155?
- CPC H10F55/155 is the Cooperative Patent Classification code for “formed in, or on, a common substrate.”
- How many patents are filed under CPC H10F55/155 (formed in, or on, a common substrate)?
- Our database includes 175 publications tagged with this CPC code.
- Is patent activity under CPC H10F55/155 growing?
- Publication counts under this code: 6 in 2024 vs 7 in 2025 (latest complete years).