Semiconductor device comprising an emitter of radiation and a photosensor and appertaining production method

Patent metadata

Field	Value
Publication number	US-9842946-B2
Application number	US-201515317641-A
Country	US
Kind code	B2
Filing date	May 22, 2015
Priority date	Jun 11, 2014
Publication date	Dec 12, 2017
Grant date	Dec 12, 2017

Abstract

The semiconductor device comprises a semiconductor substrate ( 1 ), a photosensor ( 2 ) integrated in the substrate ( 1 ) at a main surface ( 10 ), an emitter ( 12 ) of radiation mounted above the main surface ( 10 ), and a cover ( 6 ), which is at least partially transmissive for the radiation, arranged above the main surface ( 10 ). The cover ( 6 ) comprises a cavity ( 7 ), and the emitter ( 12 ) is arranged in the cavity ( 7 ). A radiation barrier ( 9 ) can be provided on a lateral surface of the cavity ( 7 ) to inhibit cross-talk between the emitter ( 12 ) and the photosensor ( 2 ).

First claim

The invention claimed is:

1. A semiconductor device, comprising:
a substrate with a main surface;
a photosensor at the main surface;
an emitter of radiation mounted above the main surface;
a cover, which is at least partially transmissive for the radiation, arranged above the main surface;
the substrate being a semiconductor substrate;
the photosensor being integrated in the substrate;
the cover comprising a cavity, the emitter being arranged in the cavity,
wherein the cover comprises a semiconductor layer arranged on a glass wafer, the cavity penetrating the semiconductor layer.

2. The semiconductor device of claim 1 , further comprising:
an integrated circuit in the substrate.

3. The semiconductor device of claim 1 , further comprising:
a radiation barrier, which shields the radiation, on a surface of the cavity.

4. The semiconductor device of claim 1 , further comprising:
a further cavity of the cover, the further cavity being arranged above the photosensor.

5. The semiconductor device of claim 1 , further comprising:
at least one passive optical component formed in or on the cover above the emitter and/or above the photosensor.

6. A semiconductor device comprising:
a substrate with a main surface;
a photosensor at the main surface;
an emitter of radiation mounted above the main surface;
a cover, which is at least partially transmissive for the radiation, arranged above the main surface;
the substrate being a semiconductor substrate;
the photosensor being integrated in the substrate;
the cover comprising a cavity, the emitter being arranged in the cavity;
a dielectric layer arranged on or above the main surface, the cover being arranged on the dielectric layer;
a wiring arranged in the dielectric layer;
a via hole penetrating the substrate outside the photosensor; and
a metallization layer arranged in the via hole, the metallization layer forming an electrical interconnection to the wiring,
wherein the emitter and the wiring comprise contact pads, and
wherein one of the contact pads of the wiring is connected with one of the contact pads of the emitter by a contact connection comprising an alloy of copper and tin.

7. The semiconductor device of claim 6 , wherein a portion of the wiring is provided as a shield inhibiting the propagation of the radiation.

8. A method of producing a semiconductor device, comprising:
integrating a photosensor at a main surface of a semiconductor substrate;
providing the main surface with a dielectric layer and with a wiring embedded in the dielectric layer, the wiring comprising a contact pad;
mounting an emitter of radiation above the main surface, a contact pad of the emitter being electrically connected with the contact pad of the wiring;
mounting a cover provided with a cavity above the main surface, so that the emitter is arranged in the cavity;
providing the emitter and the wiring with contact pads; and
connecting one of the contact pads of the wiring with one of the contact pads of the emitter by a contact connection produced by forming an alloy of copper and tin.

9. The method of claim 8 , further comprising:
forming a radiation barrier on a surface of the cavity, before the cover is mounted.

10. A method of producing a semiconductor device, comprising:
integrating a photosensor at a main surface of a semiconductor substrate;
providing the main surface with a dielectric layer and with a wiring embedded in the dielectric layer, the wiring comprising a contact pad;
mounting an emitter of radiation above the main surface, a contact pad of the emitter being electrically connected with the contact pad of the wiring;
mounting a cover provided with a cavity above the main surface, so that the emitter is arranged in the cavity;
forming the cover by applying a semiconductor layer on a glass wafer; and
forming the cavity by etching an opening into the semiconductor layer, until the glass wafer is uncovered in the opening.

11. A method of producing a semiconductor device, comprising:
integrating a photosensor at a main surface of a semiconductor substrate;
providing the main surface with a dielectric layer and with a wiring embedded in the dielectric layer, the wiring comprising a contact pad;
forming a via hole penetrating the substrate outside the photosensor;
arranging a metallization layer in the via hole, thus forming an electrical interconnection to the wiring;
mounting, after the metallization is arranged in the via hole, an emitter of radiation above the main surface, a contact pad of the emitter being electrically connected with the contact pad of the wiring; and
mounting a cover provided with a cavity above the main surface, so that the emitter is arranged in the cavity.

Assignees

• Ams Ag

Inventors

• Minixhofer Rainer
• Stering Bernhard
• Etschmaier Harald

Classifications

• H10W90/752

  between stacked chips · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/722

  between stacked chips · CPC title

• H10W72/9415

  relative to the surface, e.g. recessed, protruding · CPC title

• H10W72/07236

  Soldering or alloying · CPC title