Semiconductor memory device
US-2024237333-A9 · Jul 11, 2024 · US
Data lines or contacts therefor
Data lines or contacts therefor · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10B12/48 |
| Official title | {Data lines or contacts therefor} |
| Display label | Data lines or contacts therefor |
| Total patents | 802 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly growing.
| Year | Patents |
|---|---|
| 2015 | 24 |
| 2016 | 16 |
| 2017 | 16 |
| 2018 | 30 |
| 2019 | 24 |
| 2020 | 48 |
| 2021 | 51 |
| 2022 | 76 |
| 2023 | 115 |
| 2024 | 168 |
| 2025 | 179 |
| 2026 | 55 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Transistors with mitigated free body effect
US-2024072174-A1 · Feb 29, 2024 · US
Semiconductor structure and manufacturing method therefor
US-2024032282-A1 · Jan 25, 2024 · US
Methods for fabricating a semiconductor memory device
US-10163909-B2 · Dec 25, 2018 · US
Semiconductor memory device
US-2017373068-A1 · Dec 28, 2017 · US
Non-volatile memory device employing a deep trench capacitor
US-2017358581-A1 · Dec 14, 2017 · US
Semiconductor memory device having coplanar digit line contacts and storage node contacts in memory array and method for fabricating the same
US-2017330882-A1 · Nov 16, 2017 · US
Organic light-emitting diode display
US-2017331061-A1 · Nov 16, 2017 · US
Semiconductor devices and methods of fabricating the same
US-2017294439-A1 · Oct 12, 2017 · US
Semiconductor device including multilayer wiring layer
US-9786668-B2 · Oct 10, 2017 · US
Semiconductor device and method for forming the same
US-9773790-B1 · Sep 26, 2017 · US
Stacked memory with interface providing offset interconnects
US-9768148-B2 · Sep 19, 2017 · US
Non-volatile memory device employing a deep trench capacitor
US-9754945-B2 · Sep 5, 2017 · US
Methods of forming an elevationally extending conductor laterally between a pair of conductive lines
US-9754946-B1 · Sep 5, 2017 · US
Organic light-emitting diode display
US-9748323-B2 · Aug 29, 2017 · US
Memory device with reduced-resistance interconnect
US-2017186750-A1 · Jun 29, 2017 · US
3-dimensional stack memory device
US-9659999-B2 · May 23, 2017 · US
Non-volatile memory devices including vertical NAND channels and methods of forming the same
US-9640545-B2 · May 2, 2017 · US
Stacked memory allowing variance in device interconnects
US-9627357-B2 · Apr 18, 2017 · US
Semiconductor devices including conductive lines and methods of forming the semiconductor devices
US-2017062324-A1 · Mar 2, 2017 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10B12/48?
- CPC H10B12/48 is the Cooperative Patent Classification code for “Data lines or contacts therefor.”
- How many patents are filed under CPC H10B12/48 (Data lines or contacts therefor)?
- Our database includes 802 publications tagged with this CPC code.
- Is patent activity under CPC H10B12/48 growing?
- Publication counts under this code: 168 in 2024 vs 179 in 2025 (latest complete years).