Applying a solderable surface to conductive ink
US-12457693-B2 · Oct 28, 2025 · US
Finish coating of conductors by using conductive pastes, inks or powders
Finish coating of conductors by using conductive pastes, inks or powders · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H05K3/247 |
| Official title | {Finish coating of conductors by using conductive pastes, inks or powders} |
| Display label | Finish coating of conductors by using conductive pastes, inks or powders |
| Total patents | 46 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 6 |
| 2016 | 5 |
| 2017 | 7 |
| 2018 | 4 |
| 2019 | 2 |
| 2020 | 5 |
| 2021 | 4 |
| 2022 | 3 |
| 2023 | 3 |
| 2024 | 3 |
| 2025 | 4 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Process for manufacturing a printed circuit board and printed circuit board
US-2025287511-A1 · Sep 11, 2025 · US
Flexible printed circuit board, COF module, and electronic device comprising the same
US-12219705-B2 · Feb 4, 2025 · US
Article with catalytic ink and electrically-conductive pattern
US-2025040044-A1 · Jan 30, 2025 · US
Electroconductive substrate having metal wiring, method for producing the electroconductive substrate, and metal ink for forming metal wiring
US-12035470-B2 · Jul 9, 2024 · US
Conductive device, method for producing conductive device, and radio
US-12009586-B2 · Jun 11, 2024 · US
Applying a solderable surface to conductive ink
US-2024057266-A1 · Feb 15, 2024 · US
Method of Producing a Surface Finish on an Electrically Conductive Substrate and Electric Conductor with the Surface Finish Thereon
US-2023420164-A1 · Dec 28, 2023 · US
Applying a solderable surface to conductive ink
US-11805603-B2 · Oct 31, 2023 · US
Flexible printed circuit board, cof module, and electronic device comprising the same
US-2023135478-A1 · May 4, 2023 · US
Mounting wiring board, electronic device mounting board, method of mounting electronic device, microwave heating method, and microwave heating apparatus
US-2022402058-A1 · Dec 22, 2022 · US
Electroconductive substrate having metal wiring, method for producing the electroconductive substrate, and metal ink for forming metal wiring
US-2022015232-A1 · Jan 13, 2022 · US
Conductive device, method for producing conductive device, and radio
US-2022013892-A1 · Jan 13, 2022 · US
Electrical connector and connector system having plated ground shields
US-11183787-B2 · Nov 23, 2021 · US
Method of manufacturing circuit board with embedded conductive circuits
US-11058014-B1 · Jul 6, 2021 · US
Method for manufacturing circuit board
US-11032916-B2 · Jun 8, 2021 · US
Solder electronic components to printed conductive ink
US-2021076496-A1 · Mar 11, 2021 · US
Applying a solderable surface to conductive ink
US-2020404795-A1 · Dec 24, 2020 · US
Method for manufacturing at least one functional area on an electric contact element such as a switching contact or a plug contact
US-10862259-B2 · Dec 8, 2020 · US
Circuit board and method for manufacturing circuit board
US-2020236794-A1 · Jul 23, 2020 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H05K3/247?
- CPC H05K3/247 is the Cooperative Patent Classification code for “Finish coating of conductors by using conductive pastes, inks or powders.”
- How many patents are filed under CPC H05K3/247 (Finish coating of conductors by using conductive pastes, inks or powders)?
- Our database includes 46 publications tagged with this CPC code.
- Is patent activity under CPC H05K3/247 growing?
- Publication counts under this code: 3 in 2024 vs 4 in 2025 (latest complete years).