Method for manufacturing circuit board

Patent metadata

Field	Value
Publication number	US-11032916-B2
Application number	US-201916369055-A
Country	US
Kind code	B2
Filing date	Mar 29, 2019
Priority date	Jan 23, 2019
Publication date	Jun 8, 2021
Grant date	Jun 8, 2021

Abstract

A method for manufacturing circuit board, including: providing a substrate; printing a first conductive layer on a surface of the substrate, the first conductive layer includes a plurality of electrode units arranged in an M*N array, each of the electrode units includes a first electrode, and a plurality of second electrodes distributed around the first electrode; printing a first insulating layer on a side of the first conductive layer away from the substrate; printing a second conductive layer on a side of the first insulating layer away from the substrate; printing an anti-oxidation layer to cover surfaces of the first conductive layer and the second conductive layer away from the substrate; and printing a second insulating layer to cover regions of the substrate not covered by the first electrode and the second electrode. A circuit board is also provided.

First claim

What is claimed is:

1. A method for manufacturing a circuit board, comprising:
providing a substrate;
printing a first conductive layer on a surface of the substrate, wherein
the first conductive layer comprises a plurality of electrode units arranged in an M by N array, N being a number of first lead, and M being a number of second leads, each of the first leads is located at one end of a corresponding column of the electrode units, each of the second leads is located at one end of a corresponding row of the electrode units,
each of the electrode units comprises a first electrode, a plurality of second electrodes distributed around the first electrode, a plurality of third leads configured for connecting the second electrodes end to end, and a plurality of forth leads configured for connecting the adjacent electrode unit;

printing a first insulating layer on a side of the first conductive layer away from the substrate, the first insulating layer comprises a plurality of insulating blocks covering the third leads;
printing a second conductive layer on a side of the first insulating layer away from the substrate, wherein the second conductive layer comprises N fifth leads, each of the fifth leads is connected to the first electrode of a corresponding column of the electrode units, and is connected to a corresponding first lead;
printing an anti-oxidation layer to cover surfaces of the first conductive layer and the second conductive layer away from the substrate; and
printing a second insulating layer to cover regions of the substrate not covered by the first electrode and the second electrode.

2. The method for manufacturing circuit board as claimed in claim 1 , wherein the substrate is made of glass, polypropylene, polyethylene terephthalate, polyvinyl chloride, or polymethyl methacrylate.

3. The method for manufacturing circuit board as claimed in claim 1 , wherein M and N are positive integers greater than or equal to 2.

4. The method for manufacturing circuit board as claimed in claim 1 , wherein each of the electrode units comprises four second electrodes and four third leads, each of the third leads is configured for connecting two adjacent second electrodes, and each of the second leads is connected to a closest one of the third leads.

5. The method for manufacturing circuit board as claimed in claim 1 , wherein each of the fourth lead is configured for connecting two adjacent second electrodes of two adjacent electrode units of the same row.

6. The method for manufacturing circuit board as claimed in claim 1 , wherein the fifth lead and the third lead are separated by a corresponding insulating block to avoid electrical contact.

7. The method for manufacturing circuit board as claimed in claim 1 , wherein the first conductive layer is obtained by screen printing with silver paste.

8. The method for manufacturing circuit board as claimed in claim 1 , wherein the second conductive layer is obtained by screen printing with silver paste.

9. The method for manufacturing circuit board as claimed in claim 1 , wherein the anti-oxidation layer is obtained by screen printing with copper paste.

10. The method for manufacturing circuit board as claimed in claim 1 , wherein the first insulating layer and the second insulating layer are obtained by screen printing with dielectric materials.

Assignees

• Hon Hai Prec Ind Co Ltd

Inventors

• Huang Ren-Yi
• Tseng I-Hsun
• Chien Yuan-Hung

Classifications

• H05K3/28

  Applying non-metallic protective coatings {(H05K3/0091 takes precedence; methods for intermediate insulating layers for build-up multilayer circuits H05K3/4673)} · CPC title

• H05K3/02

  in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding · CPC title

• H05K3/4685 Primary

  Manufacturing of cross-over conductors · CPC title

• H05K3/12 Primary

  using {thick film techniques, e.g.} printing techniques to apply the conductive material {or similar techniques for applying conductive paste or ink patterns} · CPC title

• H05K1/11

  Printed elements for providing electric connections to or between printed circuits · CPC title