Conductive device, method for producing conductive device, and radio

Patent metadata

Field	Value
Publication number	US-12009586-B2
Application number	US-202017429144-A
Country	US
Kind code	B2
Filing date	Feb 6, 2020
Priority date	Feb 8, 2019
Publication date	Jun 11, 2024
Grant date	Jun 11, 2024

Abstract

The conductive device includes a substrate and an electrically conductive portion. The electrically conductive portion is provided on the substrate. The electrically conductive portion includes an electrically conductive part and a low resistance conductive layer. The electrically conductive part is provided on the substrate and includes an electrically conductive particle and an organic binder. The low resistance conductive layer covers at least part of a surface of the electrically conductive part and has lower resistivity than the electrically conductive part.

First claim

The invention claimed is:

1. A conductive device, comprising:
a substrate; and
an electrically conductive portion provided on the substrate,
the electrically conductive portion including:
an electrically conductive part provided on the substrate and including an electrically conductive particle and an organic binder; and
a low resistance conductive layer covering at least part of a surface of the electrically conductive part and having a lower resistivity than the electrically conductive part,

wherein the low resistance conductive layer is a sintered silver layer including a plurality of silver nanoparticles.

2. The conductive device of claim 1 wherein
the electrically conductive part is stretchable.

3. The conductive device of claim 1 , wherein
the substrate is a flexible substrate.

4. The conductive device of claim 1 , further comprising a protecting sheet stacked on the substrate and covering the electrically conductive portion.

5. The conductive device of any one of claim 1 , wherein the electrically conductive particle is a silver particle.

6. The conductive device of claim 1 , wherein
the substrate has a groove overlapping the electrically conductive portion in plan view in a thickness direction of the substrate, the groove extending along an edge of the electrically conductive portion, and
in the plan view in the thickness direction of the substrate, the edge of the electrically conductive portion overlaps one opening edge of a pair of opening edges in a width direction of the groove, the one opening edge being closer to the edge of the electrically conductive portion, and
the electrically conductive portion includes a projection portion inserted in the grooves.

7. The conductive device of claim 1 , wherein
the low resistance conductive layer is stacked on an entirety of the surface of the electrically conductive part.

8. A method for producing the conductive device of claim 7 , the method comprising:
preparing the substrate;
applying conductive paste to a formation target area of the electrically conductive part on the substrate, the conductive paste including the electrically conductive particle, the organic binder, and a solvent;
heating the conductive paste to form the electrically conductive part; and
forming the low resistance conductive layer on the surface of the electrically conductive part.

9. A radio comprising a conductive device as an antenna device,
the conductive device comprising:
a substrate; and
an electrically conductive portion provided on the substrate,
the electrically conductive portion including:
an electrically conductive part provided on the substrate and including an electrically conductive particle and an organic binder; and
a low resistance conductive layer covering at least part of a surface of the electrically conductive part and having a lower resistivity than the electrically conductive part,

wherein the low resistance conductive layer is a sintered silver layer including a plurality of silver nanoparticles.

10. The radio of claim 9 , further comprising a housing, wherein
the housing and the conductive device are integrated with each other.

11. The radio of claim 10 further comprising a connection terminal electrically connected to the conductive device, wherein
the conductive device is electrically connectable to a component outside the conductive device via the connection terminal.

12. The radio of claim 10 , wherein
the housing is a film insert molded product including the conductive device as a film.

13. A radio comprising:
a conductive device as an antenna device;
a housing; and
a connection terminal electrically connected to the conductive device, the conductive device comprising:
a substrate; and
an electrically conductive portion provided on the substrate, the electrically conductive portion including:
an electrically conductive part provided on the substrate and including an electrically conductive particle and an organic binder; and
a low resistance conductive layer covering at least part of a surface of the electrically conductive part and having a lower resistivity than the electrically conductive part,

wherein the housing and the conductive device are integrated with each other,
the conductive device is electrically connectable to a component outside the conductive device via the connection terminal, and
the connection terminal has:
a through part extending through the substrate in a thickness direction of the substrates; and
a base part between the substrate and the housing.

14. The radio of claim 13 , wherein
the base part has an outer peripheral part, and at least part of the outer peripheral part is thinner than a center part of the base part.

15. The radio of claim 13 , wherein
the base part has a groove formed in a surface located on an opposite side from the substrate in the thickness direction of the substrate.

Assignees

• Panasonic Ip Man Co Ltd

Inventors

• Mino Takuya
• Aketa Takanori

Classifications

• H05K3/28

  Applying non-metallic protective coatings {(H05K3/0091 takes precedence; methods for intermediate insulating layers for build-up multilayer circuits H05K3/4673)} · CPC title

• H05K3/12

  using {thick film techniques, e.g.} printing techniques to apply the conductive material {or similar techniques for applying conductive paste or ink patterns} · CPC title

• H05K1/092

  Dispersed materials, e.g. conductive pastes or inks · CPC title

• H01Q1/24

  with receiving set · CPC title

• H05K2201/09263

  Meander · CPC title