Electrically conductive polyamide substrate
US-2018371242-A1 · Dec 27, 2018 · US
using spraying techniques to apply the conductive material {, e.g. vapour evaporation}
using spraying techniques to apply the conductive material {, e.g. vapour evaporation} · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H05K3/14 |
| Official title | using spraying techniques to apply the conductive material {, e.g. vapour evaporation} |
| Display label | using spraying techniques to apply the conductive material {, e.g. vapour evaporation} |
| Total patents | 152 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly declining.
| Year | Patents |
|---|---|
| 2015 | 17 |
| 2016 | 13 |
| 2017 | 14 |
| 2018 | 20 |
| 2019 | 14 |
| 2020 | 18 |
| 2021 | 15 |
| 2022 | 13 |
| 2023 | 10 |
| 2024 | 11 |
| 2025 | 4 |
| 2026 | 3 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Bare die integration with printed components on flexible substrate without laser cut
US-10165677-B2 · Dec 25, 2018 · US
Elimination of H2S in Immersion Tin Plating Solution
US-2018347038-A1 · Dec 6, 2018 · US
Embedded lighting features for lighting panels
US-10118547-B2 · Nov 6, 2018 · US
Three dimensional sub-mm wavelength sub-THz frequency antennas on flexible and UV-curable dielectric using printed electronic metal traces
US-10086432-B2 · Oct 2, 2018 · US
Method and arrangement for transferring electrically conductive material in fluid form on a substrate to be printed
US-10085350-B2 · Sep 25, 2018 · US
Rapid prototype extruded conductive pathways
US-10085348-B2 · Sep 25, 2018 · US
Printed wiring board
US-2018270951-A1 · Sep 20, 2018 · US
Integrated wiring system for composite structures
US-10064303-B2 · Aug 28, 2018 · US
Method for producing portable data carriers
US-10015886-B2 · Jul 3, 2018 · US
Application specific electronics packaging systems, methods and devices
US-2018184526-A1 · Jun 28, 2018 · US
Ultrasonic consolidation with integrated printed electronics
US-10010020-B2 · Jun 26, 2018 · US
Wiring substrate method of manufacturing, wiring substrate and wiring substrate manufacturing device
US-2018153044-A1 · May 31, 2018 · US
Three-dimensional passive components
US-9969001-B2 · May 15, 2018 · US
Method for applying an image of an electrically conductive material onto a recording medium and device for ejecting droplets of an electrically conductive fluid
US-9922870-B2 · Mar 20, 2018 · US
Structure comprising electrically surface conductive lines and method for making electrically conductive lines on a surface of a structure
US-2018042119-A1 · Feb 8, 2018 · US
Stretchable Electrically Conductive Layer Formation By Aerosol Jet Printing On Flexible Substrate
US-2017347460-A1 · Nov 30, 2017 · US
Method for Working a First Component and a Second Component by Laser Welding and Corresponding Device
US-2017312853-A1 · Nov 2, 2017 · US
Transparent conductive coatings for optoelectronic and electronic devices
US-9807848-B2 · Oct 31, 2017 · US
Highly stretchable interconnect devices and systems
US-9770759-B2 · Sep 26, 2017 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H05K3/14?
- CPC H05K3/14 is the Cooperative Patent Classification code for “using spraying techniques to apply the conductive material {, e.g. vapour evaporation}.”
- How many patents are filed under CPC H05K3/14 (using spraying techniques to apply the conductive material {, e.g. vapour evaporation})?
- Our database includes 152 publications tagged with this CPC code.
- Is patent activity under CPC H05K3/14 growing?
- Publication counts under this code: 11 in 2024 vs 4 in 2025 (latest complete years).