Rapid prototype extruded conductive pathways

Patent metadata

Field	Value
Publication number	US-10085348-B2
Application number	US-201615187836-A
Country	US
Kind code	B2
Filing date	Jun 21, 2016
Priority date	Nov 22, 2011
Publication date	Sep 25, 2018
Grant date	Sep 25, 2018

Abstract

A process of producing electrically conductive pathways within additively manufactured parts and similar parts made by plastic extrusion nozzles. The process allows for a three-dimensional part having both conductive and non-conductive portions and allows for such parts to be manufactured in a single production step.

First claim

The invention claimed is:

1. A multi-layer three-dimensional object having a selected area of an electrically conductive portion in a selected area of a non-conducting portion, the electrically conducting portion having an x-ray density substantially equal to the x-ray density of the non-conducting portion.

2. The three-dimensional object according to claim 1 wherein at least one of the electrically conductive portions or the non-conducting portions has an x-ray density additive present.

3. The three-dimensional object according to claim 2 wherein both the electrically conducting portion and the non-electrically conducting portion have an x-ray density additive present.

4. The three-dimensional object according to claim 1 wherein a coloring agent is added to at least one of the electrically conductive or the electrically non-conductive portions so that a color of the conductive and non-conductive portions is essentially uniform.

5. The three-dimensional object according to claim 1 wherein both the electrically conductive and the electrically non-conductive portions have a coloring agent present so that the color of the conductive and non-conductive portions is essentially uniform.

Assignees

• Savannah River Nuclear Solutions Llc

Inventors

• Bobbitt Iii John Thomas

Classifications

• H05K3/22

  Secondary treatment of printed circuits {(H05K3/1283 takes precedence; embedding circuits in grooves by pressure H05K3/107)} · CPC title

• H05K3/12

  using {thick film techniques, e.g.} printing techniques to apply the conductive material {or similar techniques for applying conductive paste or ink patterns} · CPC title

• H05K2203/013

  Inkjet printing, e.g. for printing insulating material or resist · CPC title

• H05K1/0284

  Details of three-dimensional rigid printed circuit boards (H05K1/119 takes precedence; shaping of the substrate H05K3/0014) · CPC title

• B29C64/112

  using individual droplets, e.g. from jetting heads · CPC title