Integrated wiring system for composite structures

Patent metadata

Field	Value
Publication number	US-10064303-B2
Application number	US-201414282248-A
Country	US
Kind code	B2
Filing date	May 20, 2014
Priority date	May 20, 2014
Publication date	Aug 28, 2018
Grant date	Aug 28, 2018

Abstract

A method for manufacturing a composite part. Layers of composite material are cured to form the composite part. A primer is depicted on a surface of the composite part. A group of conductive elements is deposited on the primer to form an electronic device on the primer.

First claim

What is claimed is:

1. A method for manufacturing a composite part comprising:
curing layers of composite material to form the composite part;
depositing a primer on a surface of the composite part; and
forming a group of conductive elements on the primer such that an electronic device is formed on the composite part by using a direct-write process to deposit a conductive material directly onto the primer deposited on the surface of the composite part.

2. The method of claim 1 , wherein depositing the primer on the surface of the composite part comprises:
depositing a layer of metallic material on the surface of the composite part; and
depositing a layer of ceramic material on the layer of metallic material.

3. The method of claim 2 , wherein depositing the primer on the surface of the composite part comprises:
spraying the layer of metallic material on the surface of the composite part using a thermal plasma spray; and
spraying the layer of ceramic material on the layer of metallic material using the thermal plasma spray.

4. The method of claim 3 , wherein depositing the conductive material to form the group of conductive elements comprises:
spraying the conductive material on the layer of ceramic material using the thermal plasma spray to form the group of conductive elements.

5. The method of claim 1 , wherein depositing the conductive material to form the group of conductive elements on the primer comprises:
depositing conductive traces on the primer extending from one end of the composite part to another end of the composite part to form a power rail for supplying power across the composite part to power at least one connected device.

6. The method of claim 1 , wherein the direct-write process is selected from one of a thermal plasma spray, a nano-particle ink-jet process, screen-printing, an atomized jetted ink process, and kinetic metallization.

7. The method of claim 1 , wherein depositing the primer on the surface of the composite part comprises:
applying a number of layers of dielectric material to the surface of the composite part prior to depositing the conductive material to form the group of conductive elements.

8. The method of claim 1 further comprising:
applying a number of layers of protective material on top of the group of conductive elements.

9. The method of claim 1 , wherein the group of conductive elements comprises:
at least one of an electrical trace, an interconnect, a wire, a transistor, an integrated circuit, or a conductive connector.

10. The method of claim 1 , wherein the composite part is an aircraft part.

11. The method of claim 1 , further comprising providing power from a power source through the group of conductive elements to a device connected to the composite part, wherein the device connected to the composite part is selected from the group of devices configured to use the power to perform operations consisting of a light, an appliance, a control system, a sensor, a display device, a computer, a field replaceable unit, an inflight entertainment system, a graphical indicator, a beacon, an emergency device, a door system, and an audio system.

Assignees

• Boeing Co

Inventors

• Dalal Hardik
• Duce Jeffrey Lynn
• Rosillo Yelina
• Robbins Brent A
• Merriweather Breana K

Classifications

• H05K2201/0999

  Circuit printed on or in housing, e.g. housing as PCB; Circuit printed on the case of a component; PCB affixed to housing · CPC title

• H05K3/14

  using spraying techniques to apply the conductive material {, e.g. vapour evaporation} · CPC title

• B64F5/00

  Designing, manufacturing, assembling, cleaning, maintaining or repairing aircraft, not otherwise provided for; Handling, transporting, testing or inspecting aircraft components, not otherwise provided for · CPC title

• H05K3/4673

  Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer (similar methods for protective coatings H05K3/28) · CPC title

• H05K2201/09018

  Rigid curved substrate · CPC title