Bare die integration with printed components on flexible substrate without laser cut

Patent metadata

Field	Value
Publication number	US-10165677-B2
Application number	US-201514965039-A
Country	US
Kind code	B2
Filing date	Dec 10, 2015
Priority date	Dec 10, 2015
Publication date	Dec 25, 2018
Grant date	Dec 25, 2018

Abstract

Provided is a manufacturing process for electronic circuit components such as bare dies, and packaged integrated chips, among other configurations, to form electronic assemblies. The surface of the electronic circuit component carries electronic elements such as conductive traces and/or other configurations including contact pads. A method for forming an electronic assembly includes providing a tacky layer. Then an electronic circuit component is provided having a first side and a second side, where the first side carries the electronic elements. The first side of the electronic circuit component is positioned into contact with the tacky layer. A bonding material is then deposited to a portion of the adhesive layer that is not covered by the first side of the electronic circuit component, to a depth which is sufficient to cover at least a portion of the electronic circuit component. The bonding material is then fixed or cured into a fixed or cured bonding material, and the tacky layer is removed. By these operations, the electronic circuit component is held in a secure attachment by the fixed or cured bonding material, and circuit connections may be made.

First claim

What is claimed is:

1. A method of forming an electronic assembly comprising:
providing a tacky layer;
providing an electronic circuit component having a first side and a second side, the first side carrying electronics;
positioning the first side of the electronic circuit component into contact with the tacky layer;
depositing a bonding material to a portion of the tacky layer not covered by the first side of the electronic circuit component to a depth which substantially covers the second side of the electronic circuit component;
curing the bonding material into a cured bonding material, wherein the deposited cured bonding material consists of a stiffer material composition closer to the electronic circuit component and a less stiff material composition farther away from the electronic circuit component, and wherein the deposited cured bonding material consisting of the stiffer material composition and the less stiff material composition are cured at substantially a same time during a same curing operation; and
removing the tacky layer, wherein the electronic circuit component is held in secure attachment by the cured bonding material.

2. The method according to claim 1 wherein the depositing is accomplished using at least two different print heads, containing different curable bonding material compositions.

3. The method according to claim 1 wherein the depositing is accomplished using a single print head and wherein the bonding material is a varying UV curable polymer material.

4. A method of forming an electronic assembly comprising:
providing a tacky layer;
providing an electronic circuit component having a first side and a second side, the first side carrying electronics;
positioning the first side of the electronic circuit component into contact with the tacky layer;
depositing a bonding material to a portion of the tacky layer not covered by the first side of the electronic circuit component to a depth which substantially covers the second side of the electronic circuit component;
curing the bonding material into a cured bonding material; and
removing the tacky layer, wherein the electronic circuit component is held in secure attachment by the cured bonding material,
wherein the tacky layer is formed with a cavity portion defined by sloping sides and a planar portion between the sloping sides, the planar portion being sized to receive the electronic circuit component,
wherein the first side of the electronic circuit component is positioned in contact with the tacky layer on a surface of the planar portion, wherein the first side is in contact with the surface of the planar portion of the tacky layer; and
wherein the depositing further includes depositing the cured bonding material to a portion of the tacky layer not covered by the first side of the electronic circuit component to a depth which substantially covers the second side of the electronic circuit component, thereby filing in the remaining cavity portion with the bonding material.

5. The method according to claim 1 wherein the first side of the electronic circuit component and a first surface of the cured bonding material are substantially planar to each other.

6. The method of claim 5 further including laying down conductive traces between the cured bonding material and the first side of the electronic circuit component.

7. The method according to claim 1 further including:
depositing a preliminary bonding material prior to the step of depositing the bonding material, wherein the preliminary bonding material extends along a portion of the tacky layer and up in a height direction along sides of the electronic circuit component; and
curing the preliminary bonding material into a preliminary cured bonding material prior to the step of depositing the bonding material, and wherein the preliminary cured bonding material has a stiffer constitution than the cured bonding material.

8. The method according to claim 1 further including:
positioning a substantially transparent substrate on a surface of the tacky layer and a surface of the bonding material;
the curing of the bonding material includes providing curing through the transparent substrate to the bonding material to cure the bonding material; and
the removing of the tacky layer provides a ramp configuration on each side of the conductive electronic component.

9. The method according to claim 1 wherein the depositing of the bonding material is at least one of ink-jet type printing, aerosol type printing, and extrusion type printing.

10. The method of claim 4 further including laying down conductive traces between the cured bonding material and the first side of the electronic circuit component.

11. The method according to claim 4 further including:
depositing a preliminary bonding material prior to the step of depositing the bonding material, wherein the preliminary bonding material extends along a portion of the tacky layer and up in a height direction along sides of the electronic circuit component; and
curing the preliminary bonding material into a preliminary cured bonding material prior to the step of depositing the bonding material, and wherein the preliminary cured bonding material has a stiffer constitution than the cured bonding material.

12. The method according to claim 4 wherein the deposited cured bonding material consists of a stiffer material composition closer to the electronic circuit component and a less stiff material composition farther away from the electronic circuit component.

13. The method according to claim 4 further including:
positioning a substantially transparent substrate on a surface of the tacky layer and a surface of the bonding material;
the curing of the bonding material includes providing curing through the transparent substrate to the bonding material to cure the bonding material; and
the removing of the tacky layer provides a ramp configuration on each side of the conductive electronic component.

Assignees

• Palo Alto Res Ct Inc

Inventors

• Mei Ping
• Ng Tse Nga
• Krusor Brent S
• Whiting Gregory L
• Ready Steven E
• Veres Janos

Classifications

• H10W74/111

  the semiconductor body being completely enclosed · CPC title

• H10W72/9413

  on encapsulations · CPC title

• H10W72/07141

  Means for applying energy, e.g. ovens or lasers · CPC title

• H10W72/07131

  Means for applying material, e.g. for deposition or forming coatings · CPC title

• H10W70/6523

  for connecting to pads at different heights at the same side of the package substrate, interposer or RDL · CPC title