Coating composition and laminate
US-2024093052-A1 · Mar 21, 2024 · US
containing halogen
containing halogen · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H05K1/034 |
| Official title | {containing halogen} |
| Display label | containing halogen |
| Total patents | 182 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is growing.
| Year | Patents |
|---|---|
| 2015 | 7 |
| 2016 | 10 |
| 2017 | 9 |
| 2018 | 19 |
| 2019 | 12 |
| 2020 | 15 |
| 2021 | 14 |
| 2022 | 28 |
| 2023 | 24 |
| 2024 | 24 |
| 2025 | 18 |
| 2026 | 2 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Substrate for pattern formation
US-11898008-B2 · Feb 13, 2024 · US
Functional substrates for printed electronic devices
US-2020281077-A1 · Sep 3, 2020 · US
Substrate for high-frequency printed wiring board
US-10485102-B2 · Nov 19, 2019 · US
Wiring board manufacturing method and wiring board
US-10477694-B2 · Nov 12, 2019 · US
Polyphenyl ether resin composition and prepreg, laminated board and printed circuit board containing same
US-10465069-B2 · Nov 5, 2019 · US
Epoxy resin composition
US-2019322858-A1 · Oct 24, 2019 · US
Radio-frequency printed circuit board and wiring material
US-10383215-B2 · Aug 13, 2019 · US
Substrate for high-frequency printed wiring board
US-2019215957-A1 · Jul 11, 2019 · US
Tamper-respondent assemblies
US-10334722-B2 · Jun 25, 2019 · US
Wiring board manufacturing method and wiring board
US-2019159345-A1 · May 23, 2019 · US
Method for producing liquid composition containing fluororesin powder
US-2019100635-A1 · Apr 4, 2019 · US
Laminate, method for producing the same, and method for forming conductive pattern
US-2019098767-A1 · Mar 28, 2019 · US
Composite and nanowire conduit
US-10177471-B2 · Jan 8, 2019 · US
Polyphenyl ether resin composition and prepreg, laminated board and printed circuit board containing same
US-2019002689-A1 · Jan 3, 2019 · US
Thermosetting resin composition, prepreg containing same, laminated board, and printed circuit board
US-2018346675-A1 · Dec 6, 2018 · US
Wiring board and method for manufacturing the same
US-10136521-B2 · Nov 20, 2018 · US
High-speed interconnects for printed circuit boards
US-2018332720-A1 · Nov 15, 2018 · US
Block copolymers in laminate manufacturing
US-10093764-B2 · Oct 9, 2018 · US
Implementing backdrilling elimination utilizing anti-electroplate coating
US-10076045-B2 · Sep 11, 2018 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H05K1/034?
- CPC H05K1/034 is the Cooperative Patent Classification code for “containing halogen.”
- How many patents are filed under CPC H05K1/034 (containing halogen)?
- Our database includes 182 publications tagged with this CPC code.
- Is patent activity under CPC H05K1/034 growing?
- Publication counts under this code: 24 in 2024 vs 18 in 2025 (latest complete years).