Wiring board manufacturing method and wiring board

Patent metadata

Field	Value
Publication number	US-10477694-B2
Application number	US-201615735772-A
Country	US
Kind code	B2
Filing date	Jun 22, 2016
Priority date	Jul 30, 2015
Publication date	Nov 12, 2019
Grant date	Nov 12, 2019

Abstract

A wiring board manufacturing method and a wiring board in which a pattern can be simply and easily formed even when using a coating composition having a high surface tension are provided. The method includes a transferring step of bringing a resin composition containing a first compound inducing a low surface free energy and a second compound inducing a surface free energy which is higher than that of the first compound into contact with a master on which a desired surface free energy difference pattern is formed and curing the resin composition to form a base material to which the surface free energy difference pattern is transferred; and a conductor pattern forming step of applying a conductive coating composition onto a pattern transfer surface of the base material to form a conductor pattern, the base material having a pattern of a high surface free energy region and a low surface free energy region, and the high surface free energy region having a surface free energy of more than 62 mJ/m 2 .

First claim

The invention claimed is:

1. A method for manufacturing a wiring board comprising:
a transferring step of bringing a resin composition containing a first compound inducing a low surface free energy and a second compound inducing a surface free energy which is higher than that of the first compound into contact with a master on which a desired surface free energy difference pattern is formed and curing the resin composition to form a base material to which the surface free energy difference pattern is transferred; and
a conductor pattern forming step of applying a conductive coating composition onto a pattern transfer surface of the base material to form a conductor pattern,
wherein the base material has a pattern of a high surface free energy region and a low surface free energy region, and
wherein the high surface free energy region has a surface free energy of more than 62 mJ/m 2 .

2. The method for manufacturing a wiring board according to claim 1 , wherein the surface free energy of the high surface free energy region is higher than a surface free energy of the conductive coating composition minus 10 mJ/m 2 .

3. The method for manufacturing a wiring board according to claim 1 , wherein the low surface free energy region has a surface free energy of 10 to 20 mJ/m 2 .

4. The method for manufacturing a wiring board according to claim 1 , wherein the conductive coating composition contains silver.

5. The method for manufacturing a wiring board according to claim 1 , wherein the first compound is a perfluoropolyether derivative.

6. The method for manufacturing a wiring board according to claim 1 , wherein the second compound contains a monofunctional (meth)acrylate, and
wherein content of the monofunctional (meth)acrylate is 40 to 70 pts. mass with respect to 100 pts. mass of the second compound.

7. A wiring board comprising:
a base material having a pattern of a high surface free energy region and a low surface free energy region; and
a conductor pattern formed on the high surface free energy region,
wherein the high surface free energy region has a surface free energy of more than 62 mJ/m 2 .

8. The wiring board according to claim 7 , wherein the conductor pattern is formed from a conductive coating composition, and
wherein the surface free energy of the high surface free energy region is higher than a surface free energy of the conductive coating composition minus 10 mJ/m 2 .

9. The wiring board according to claim 7 , wherein the low surface free energy region has a surface free energy of 10 to 20 mJ/m 2 .

10. The wiring board according to claim 8 , wherein the conductive coating composition contains silver.

11. A method for manufacturing a pattern formation body comprising:
a transferring step of bringing a resin composition containing a first compound inducing a low surface free energy and a second compound inducing a surface free energy which is higher than that of the first compound into contact with a master on which a desired surface free energy difference pattern is formed and curing the resin composition to form a base material to which the surface free energy difference pattern is transferred; and
a pattern forming step of applying a coating composition onto a pattern transfer surface of the base material to form a pattern,
wherein the base material has a pattern of a high surface free energy region and a low surface free energy region, and
wherein the high surface free energy region has a surface free energy of more than 62 mJ/m 2 .

12. A pattern formation body comprising:
a base material having a pattern of a high surface free energy region and a low surface free energy region; and
a pattern formed on the high surface free energy region, wherein the high surface free energy region has a surface free energy of more than 62 mJ/m 2 .

13. A base material, formed by curing a resin composition containing a first compound inducing a low surface free energy and a second compound inducing a surface free energy which is higher than that of the first compound, comprising:
a pattern of a high surface free energy region and a low surface free energy region, wherein the high surface free energy region has a surface free energy of more than 62 mJ/m 2 .

14. A resin composition comprising:
a first compound inducing a low surface free energy; and
a second compound inducing a surface free energy which is higher than that of the first compound,
wherein the second compound contains a monofunctional (meth)acrylate, and
wherein content of the monofunctional (meth)acrylate is 40 to 70 pts. mass with respect to 100 pts. mass of the second compound.

15. The resin composition according to claim 14 , wherein the first compound is a perfluoropolyether derivative.

Assignees

• Dexerials Corp

Inventors

• Ito Makiya
• Endo Ryosuke
• Goto Kazuo

Classifications

• H05K2201/09681

  Mesh conductors, e.g. as a ground plane · CPC title

• H05K2201/0145

  Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN] · CPC title

• H05K2201/015

  Fluoropolymer, e.g. polytetrafluoroethylene [PTFE] · CPC title

• H05K1/034

  containing halogen · CPC title

• H05K2203/0195

  Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure · CPC title