Fluororesin base material, printed wiring board, and circuit module
US-2016250830-A1 · Sep 1, 2016 · US
Substrate for high-frequency printed wiring board
US10485102B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10485102-B2 |
| Application number | US-201816336211-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 20, 2018 |
| Priority date | Aug 8, 2017 |
| Publication date | Nov 19, 2019 |
| Grant date | Nov 19, 2019 |
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- Title
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- Abstract
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Abstract
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A first embodiment of a substrate for a high-frequency printed wiring board according to the present disclosure is directed to a substrate for a high-frequency printed wiring board, the substrate including: a dielectric layer including a fluororesin and an inorganic filler; and a copper foil layered on at least one surface of the dielectric layer, wherein a surface of the copper foil at the dielectric layer side has a maximum height roughness (Rz) of less than or equal to 2 μm, and a ratio of the number of inorganic atoms of the inorganic filler to the number of fluorine atoms of the fluororesin in a superficial region of the dielectric layer at the copper foil side is less than or equal to 0.08.
First claim
Opening claim text (preview).
The invention claimed is: 1. A substrate for a high-frequency printed wiring board, the substrate comprising: a dielectric layer including a fluororesin and an inorganic filler; and a copper foil layered on at least one surface of the dielectric layer, wherein a surface of the copper foil at the dielectric layer side has a maximum height roughness (Rz) of less than or equal to 2 μm, a ratio of the number of inorganic atoms of the inorganic filler to the number of fluorine atoms of the fluororesin in a superficial region of the dielectric layer at the copper foil side is less than or equal to 0.08, and a softening temperature of the fluororesin is more than or equal to 250° C. and less than or equal to 310° C. 2. The substrate for a high-frequency printed wiring board according to claim 1 , wherein the fluororesin is a tetrafluoroethylene-hexafluoropropylene copolymer, a tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer, polytetrafluoroethylene, or a combination of the tetrafluoroethylen e-hexafluoropropylene copolymer, the tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer, and the polytetrafluoroethylene. 3. The substrate for a high-frequency printed wiring board according to claim 2 , wherein the fluororesin is the tetrafluoroethylene-hexafluoropropylene copolymer. 4. The substrate for a high-frequency printed wiring board according to claim 1 , wherein a mass ratio of the inorganic filler to the fluororesin in the dielectric layer is more than or equal to 1.0. 5. The substrate for a high-frequency printed wiring board according to claim 1 , wherein the inorganic filler includes silica. 6. The substrate for a high-frequency printed wiring board according to claim 1 , wherein a linear expansion coefficient of the substrate in a thickness direction is less than or equal to 50 ppm/K. 7. The substrate for a high-frequency printed wiring board according to claim 1 , wherein a change of permittivity of the substrate by a temperature in a range of 25° C. to 120° C. is less than or equal to 2%. 8. A substrate for a high-frequency printed wiring board, the substrate comprising: a dielectric layer including a fluororesin and an inorganic filler; and a copper foil layered on at least one surface of the dielectric layer, wherein a surface of the copper foil at the dielectric layer side has a maximum height roughness (Rz) of less than or equal to 2 μm, and in a cross section of the dielectric layer in a direction perpendicular to the copper foil, a ratio of a total cross sectional area of the inorganic filler to an overall cross sectional area in a region at a distance of more than or equal to 18 μm and less than or equal to 22 μm from the copper foil is 0.7 time or less as large as a ratio of a total cross sectional area of the inorganic filler to an overall cross sectional area in a region at a distance of more than or equal to 0 μm and less than or equal to 2 μm from the copper foil.
Assignees
Inventors
Classifications
- H05K1/034Primary
containing halogen · CPC title
Metal foils · CPC title
using fillers, pigments, thixotroping agents · CPC title
comprising aluminium or copper {(B32B15/016 and B32B15/017 take precedence)} · CPC title
comprising vinyl resins; comprising acrylic resins · CPC title
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- What does patent US10485102B2 cover?
- A first embodiment of a substrate for a high-frequency printed wiring board according to the present disclosure is directed to a substrate for a high-frequency printed wiring board, the substrate including: a dielectric layer including a fluororesin and an inorganic filler; and a copper foil layered on at least one surface of the dielectric layer, wherein a surface of the copper foil at the die…
- Who is the assignee on this patent?
- Sumitomo Electric Industries, Sumitomo Electric Printed Circuits Inc
- What technology area does this patent fall under?
- Primary CPC classification H05K1/034. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Nov 19 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).