Printed circuit board
US-2016374198-A1 · Dec 22, 2016 · US
consisting of one material
consisting of one material · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H05K1/032 |
| Official title | {consisting of one material} |
| Display label | consisting of one material |
| Total patents | 269 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 34 |
| 2016 | 33 |
| 2017 | 25 |
| 2018 | 18 |
| 2019 | 20 |
| 2020 | 14 |
| 2021 | 28 |
| 2022 | 21 |
| 2023 | 21 |
| 2024 | 33 |
| 2025 | 19 |
| 2026 | 3 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Electronic module for a piece of vehicle-borne aeronautic equipment and a piece of aeronautic equipment for an aeronautic vehicle
US-9526170-B2 · Dec 20, 2016 · US
Metal-free monolithic epitaxial graphene-on-diamond PWB
US-9504158-B2 · Nov 22, 2016 · US
Methods of patterning a conductor on a substrate
US-9487040-B2 · Nov 8, 2016 · US
Aluminum nitride substrate
US-2016323992-A1 · Nov 3, 2016 · US
High performance, ultra low loss, ultra lightweight, multi-layered rigid circuit boards
US-2016316556-A1 · Oct 27, 2016 · US
Wiring board and method for manufacturing the same
US-9480157-B2 · Oct 25, 2016 · US
Conducting film or electrode with improved optical and electrical performance
US-2016309583-A1 · Oct 20, 2016 · US
Production method for thermoplastic liquid crystal polymer film, circuit board and production method therefor
US-2016236402-A1 · Aug 18, 2016 · US
Transparent conducting article comprising first and second conductive layers and an intervening inorganic dielectric layer having a plurality of apertures therein
US-9402305-B2 · Jul 26, 2016 · US
Graphene mounted on aerogel
US-2016203910-A1 · Jul 14, 2016 · US
Resin article having plating layer and manufacturing method thereof, and conductive film
US-2016186325-A1 · Jun 30, 2016 · US
Dielectric filmless electronic module and method for manufacturing same
US-2016183377-A1 · Jun 23, 2016 · US
Thermosetting resin composition and prepreg as well as hardened product using the same
US-2016177082-A1 · Jun 23, 2016 · US
Low package parasitic inductance using a thru-substrate interposer
US-9370103-B2 · Jun 14, 2016 · US
Electronic circuit assembly substrate and device thereof
US-2016165729-A1 · Jun 9, 2016 · US
Printed wiring board and method for manufacturing the same
US-9363891-B2 · Jun 7, 2016 · US
METHOD AND APPARATUS FOR QUANTIFYING DEFECTS DUE TO THROUGH SILICON VIAs IN INTEGRATED CIRCUITS
US-2016116526-A1 · Apr 28, 2016 · US
Aluminum nitride substrate
US-9326373-B2 · Apr 26, 2016 · US
Method for electronic circuit assembly on a paper substrate
US-9318466-B2 · Apr 19, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H05K1/032?
- CPC H05K1/032 is the Cooperative Patent Classification code for “consisting of one material.”
- How many patents are filed under CPC H05K1/032 (consisting of one material)?
- Our database includes 269 publications tagged with this CPC code.
- Is patent activity under CPC H05K1/032 growing?
- Publication counts under this code: 33 in 2024 vs 19 in 2025 (latest complete years).