Stacked inorganic-organic dielectrics for thin film capacitors in package substrates
US-2024222295-A1 · Jul 4, 2024 · US
US9504158B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9504158-B2 |
| Application number | US-201414258448-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 22, 2014 |
| Priority date | Apr 22, 2014 |
| Publication date | Nov 22, 2016 |
| Grant date | Nov 22, 2016 |
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According to some embodiments, an apparatus includes a circuit board made of polycrystalline diamond. The circuit board is formed by deposition of layers of poly(hydridocarbyne). Each layer has the geometry of a cross section of the circuit board. The circuit board is further formed by pyrolysis of the layers of poly(hydridocarbyne) at a temperature greater than or equal to 100 degrees Celsius and less than or equal to 800 degrees Celsius. The apparatus additionally includes a plurality of tubes formed within the circuit board. The tubes have a plurality of terminations at one or more surfaces of the circuit board. Each tube comprises a layer of graphene that is operable to permit each tube to conduct electrical current. Each layer of graphene is formed by thermolysis of the polycrystalline diamond circuit board at a temperature greater than or equal to 900 degrees Celsius. Each tube is substantially hollow each layer of graphene forms an outer surface of the respective tube.
Opening claim text (preview).
What is claimed is: 1. An apparatus comprising: a circuit board made of polycrystalline diamond; and a substantially hollow tube formed within the circuit board, the tube terminating at one or more surfaces of the circuit board, the tube comprising a layer of graphene that is operable to permit the tube to conduct electrical current. 2. The apparatus of claim 1 , wherein the layer of graphene forms an outer surface of the tube. 3. The apparatus of claim 1 , wherein the tube further comprises a layer of polycrystalline diamond that forms an outer surface of the tube, the layer of polycrystalline diamond being deposited over the layer of graphene. 4. The apparatus of claim 1 , wherein the tube further comprises one or more internal support structures. 5. The apparatus of claim 1 , further comprising a capacitor formed within the circuit board, the capacitor comprising: a first layer of graphene; a second layer of graphene; and a layer of polycrystalline diamond located between the first and second layers of graphene. 6. The apparatus of claim 1 , further comprising one or more cooling tubes formed within the circuit board, the cooling tubes configured to transmit a liquid through at least a portion of the circuit board. 7. The apparatus of claim 1 , further comprising a plurality of heat sink fins formed on a surface of the circuit board, the plurality of heat sink fins made of polycrystalline diamond, the plurality of fins operable to conduct heat away from the circuit board. 8. The apparatus of claim 1 , further comprising an electrical device connected to the tube at a termination of the tube. 9. The apparatus of claim 1 , wherein at least one termination of the tube is open to an atmosphere. 10. The apparatus of claim 1 , wherein the polycrystalline diamond comprises hexagonal polycrystalline diamond.
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