Metal-free monolithic epitaxial graphene-on-diamond PWB

US9504158B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9504158-B2
Application numberUS-201414258448-A
CountryUS
Kind codeB2
Filing dateApr 22, 2014
Priority dateApr 22, 2014
Publication dateNov 22, 2016
Grant dateNov 22, 2016

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

According to some embodiments, an apparatus includes a circuit board made of polycrystalline diamond. The circuit board is formed by deposition of layers of poly(hydridocarbyne). Each layer has the geometry of a cross section of the circuit board. The circuit board is further formed by pyrolysis of the layers of poly(hydridocarbyne) at a temperature greater than or equal to 100 degrees Celsius and less than or equal to 800 degrees Celsius. The apparatus additionally includes a plurality of tubes formed within the circuit board. The tubes have a plurality of terminations at one or more surfaces of the circuit board. Each tube comprises a layer of graphene that is operable to permit each tube to conduct electrical current. Each layer of graphene is formed by thermolysis of the polycrystalline diamond circuit board at a temperature greater than or equal to 900 degrees Celsius. Each tube is substantially hollow each layer of graphene forms an outer surface of the respective tube.

First claim

Opening claim text (preview).

What is claimed is: 1. An apparatus comprising: a circuit board made of polycrystalline diamond; and a substantially hollow tube formed within the circuit board, the tube terminating at one or more surfaces of the circuit board, the tube comprising a layer of graphene that is operable to permit the tube to conduct electrical current. 2. The apparatus of claim 1 , wherein the layer of graphene forms an outer surface of the tube. 3. The apparatus of claim 1 , wherein the tube further comprises a layer of polycrystalline diamond that forms an outer surface of the tube, the layer of polycrystalline diamond being deposited over the layer of graphene. 4. The apparatus of claim 1 , wherein the tube further comprises one or more internal support structures. 5. The apparatus of claim 1 , further comprising a capacitor formed within the circuit board, the capacitor comprising: a first layer of graphene; a second layer of graphene; and a layer of polycrystalline diamond located between the first and second layers of graphene. 6. The apparatus of claim 1 , further comprising one or more cooling tubes formed within the circuit board, the cooling tubes configured to transmit a liquid through at least a portion of the circuit board. 7. The apparatus of claim 1 , further comprising a plurality of heat sink fins formed on a surface of the circuit board, the plurality of heat sink fins made of polycrystalline diamond, the plurality of fins operable to conduct heat away from the circuit board. 8. The apparatus of claim 1 , further comprising an electrical device connected to the tube at a termination of the tube. 9. The apparatus of claim 1 , wherein at least one termination of the tube is open to an atmosphere. 10. The apparatus of claim 1 , wherein the polycrystalline diamond comprises hexagonal polycrystalline diamond.

Assignees

Inventors

Classifications

  • Carbon nanotubes · CPC title

  • consisting of one material · CPC title

  • Layered products essentially comprising ceramics, e.g. refractory products · CPC title

  • obtained from {Si-containing} polymer precursors {or organosilicon monomers} · CPC title

  • Organic compounds becoming part of a ceramic after heat treatment, e.g. carbonising phenol resins · CPC title

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Frequently asked questions

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What does patent US9504158B2 cover?
According to some embodiments, an apparatus includes a circuit board made of polycrystalline diamond. The circuit board is formed by deposition of layers of poly(hydridocarbyne). Each layer has the geometry of a cross section of the circuit board. The circuit board is further formed by pyrolysis of the layers of poly(hydridocarbyne) at a temperature greater than or equal to 100 degrees Celsius …
Who is the assignee on this patent?
Findley David G, Facebook Inc
What technology area does this patent fall under?
Primary CPC classification H05K1/162. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Nov 22 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).