Printed wiring board and method for manufacturing the same

Patent metadata

Field	Value
Publication number	US-9363891-B2
Application number	US-201514680463-A
Country	US
Kind code	B2
Filing date	Apr 7, 2015
Priority date	Dec 24, 2008
Publication date	Jun 7, 2016
Grant date	Jun 7, 2016

Abstract

A printed wiring board includes a resin insulation layer having a first surface and a second surface on an opposite side of the first surface, the resin insulation layer having an opening for a via conductor, a pad formed on the first surface of the resin insulation layer and provided to mount an electronic component, a conductive circuit formed on the second surface of the resin insulation layer, and a via conductor formed in the opening and connecting the pad and the conductive circuit. The pad has an embedded portion embedded in the resin insulation layer and a protruding portion protruding from the resin insulation layer, and the embedded portion has an external shape which is greater than an external shape the protruding portion.

First claim

What is claimed is:

1. A printed wiring board, comprising:
an outermost resin insulation layer having a first surface and a second surface on an opposite side with respect to the first surface; and
a plurality of conducting structures formed in the outermost resin insulation layer such that the plurality of conducting structures is positioned in an electronic component mounting region of the outermost resin insulation layer,
wherein each of the conducting structures is formed in an opening formed in the outermost resin insulation layer such that each of the conducting structures extends from the first surface to the second surface of the outermost resin insulation layer, each of the conducting structures comprises a pad comprising copper on a first surface side of the outermost resin insulation layer, a conductive circuit formed on the second surface of the outermost resin insulation layer and a via conductor connecting the pad and the conductive circuit, the pad comprises an embedded portion embedded in the outermost resin insulation layer and a protruding portion protruding from the embedded portion beyond the first surface of the outermost resin insulation layer, the embedded portion has an external shape which is greater than an external shape of the protruding portion such that the embedded portion has an upper surface recessed from the first surface of the outermost resin insulating layer, and each of the conducting structures comprises a plated-film formed on a surface of the protruding portion and the upper surface of the embedded portion and has a thickness such that when a solder bump is reflowed on the pad, the plated-film is fused into the solder bump and the solder bump is formed directly on the pad.

2. The printed wiring board according to claim 1 , further comprising:
at least one insulating layer comprising a lower resin insulation layer on which the outermost resin insulation layer is formed.

3. The printed wiring board according to claim 1 , wherein the plated-film comprises a solder-plated film formed on the surface of the protruding portion.

4. The printed wiring board according to claim 1 , further comprising:
a plurality of solder bumps formed on the plurality of conducting structures respectively such that each of the solder bumps is formed directly on the pad.

5. The printed wiring board according to claim 1 , further comprising:
a solder-plated film formed on a surface of the protruding portion,
wherein the opening has a surface diameter on the second surface of the outermost resin insulation layer, and the via conductor has a contacting portion in contact with the pad such that the contact portion has a contact diameter which is smaller than the surface diameter of the opening on the second surface.

6. The printed wiring board according to claim 1 , further comprising:
a plurality of solder bumps formed on the plurality of conducting structures respectively such that each of the solder bumps is formed directly on the pad,
wherein the opening has a surface diameter on the second surface of the outermost resin insulation layer, and the via conductor has a contacting portion in contact with the pad such that the contact portion has a contact diameter which is smaller than the surface diameter of the opening on the second surface.

7. The printed wiring board according to claim 1 , wherein the plated-film comprises a solder-plated film formed on the surface of the protruding portion and the upper surface of the embedded portion.

8. The printed wiring board according to claim 7 , wherein the solder-plated film has a side surface formed on the upper surface of the embedded portion and the side surface of the coating layer is in contact with the outermost resin insulation layer.

9. The printed wiring board according to claim 1 , wherein the protruding portion and the embedded portion are directly connected.

10. The printed wiring board according to claim 1 , wherein the embedded portion is formed in the opening of the outermost resin insulation layer such that the embedded portion has a side surface in contact with the outermost resin insulation layer.

11. The printed wiring board according to claim 1 , further comprising:
a plurality of solder bumps formed on the plurality of conducting structures respectively such that each of the solder bump is formed directly on the protruding portion and directly on the upper surface of the embedded portion.

12. The printed wiring board according to claim 1 , wherein the embedded portion has an outer diameter which is greater than an outer diameter of the protruding portion.

13. The printed wiring board of claim 1 , further comprising:
a plurality of resin insulating layers on which the outermost resin insulation layer,
wherein the plurality of resin insulating layers comprises less than four resin insulating layers, and one of said resin insulating layers comprises core material.

14. The printed wiring board of claim 13 , wherein the core material comprises at least one of glass cloth, glass non-woven fabric and aramid non-woven fabric.

15. The printed wiring board of claim 1 , further comprising:
a plurality of resin insulating layers on which the outermost insulation layer is formed and each of which does not include core material.

16. The printed wiring board of claim 1 , wherein the opening has a surface diameter on the second surface of the outermost resin insulation layer, and the via conductor has a contacting portion in contact with the pad such that the contact portion has a contact diameter which is smaller than the surface diameter of the opening on the second surface.

17. The printed wiring board of claim 2 , wherein the opening has a surface diameter on the second surface of the outermost resin insulation layer, and the via conductor has a contacting portion in contact with the pad such that the contact portion has a contact diameter which is smaller than the surface diameter of the opening on the second surface.

18. The printed wiring board of claim 2 , wherein the plated-film comprises a solder-plated film formed on the surface of the protruding portion.

19. The printed wiring board of claim 2 , further comprising:
a plurality of solder bumps formed on the plurality of conducting structures respectively such that each of the solder bumps is formed directly on the pad.

20. The printed wiring board of claim 1 , wherein the embedded portion has an outer diameter which is greater than an outer diameter of the protruding portion, the opening has a surface diameter on the second surface of the outermost resin insulation layer, and the via conductor has a contacting portion in contact with the pad such that the contact portion has a contact diameter which is smaller than the surface diameter of the opening on the second surface.

Assignees

• Ibiden Co Ltd

Inventors

• Kawai Satoru
• Sakai Kenji
• Chen Liyi

Classifications

• H05K2203/0361

  Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser · CPC title

• H05K2201/0195

  Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure · CPC title

• Y10T29/49165

  by forming conductive walled aperture in base · CPC title

• H05K2201/0367

  Metallic bump or raised conductor not used as solder bump · CPC title

• H05K1/113 Primary

  Via provided in pad; Pad over filled via · CPC title