Wafer level chip scale filter packaging using semiconductor wafers with through wafer vias
US-10483248-B2 · Nov 19, 2019 · US
for bulk acoustic wave [BAW] devices
for bulk acoustic wave [BAW] devices · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H03H9/1007 |
| Official title | {for bulk acoustic wave [BAW] devices} |
| Display label | for bulk acoustic wave [BAW] devices |
| Total patents | 223 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 16 |
| 2016 | 11 |
| 2017 | 17 |
| 2018 | 14 |
| 2019 | 31 |
| 2020 | 34 |
| 2021 | 18 |
| 2022 | 22 |
| 2023 | 25 |
| 2024 | 18 |
| 2025 | 14 |
| 2026 | 3 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Method of providing protective cavity and integrated passive components in wafer level chip scale package using a carrier wafer
US-10374574-B2 · Aug 6, 2019 · US
Acoustic wave device and method of manufacturing the same
US-10164602-B2 · Dec 25, 2018 · US
Wafer level package and manufacturing method thereof
US-2018358308-A1 · Dec 13, 2018 · US
Method and structure for single crystal acoustic resonator devices using thermal recrystallization
US-2018342999-A1 · Nov 29, 2018 · US
Acoustic wave device and method of manufacturing the same
US-2018337651-A1 · Nov 22, 2018 · US
Bulk-acoustic wave filter device
US-10135421-B2 · Nov 20, 2018 · US
Wafer level chip scale filter packaging using semiconductor wafers with through wafer vias
US-2018277527-A1 · Sep 27, 2018 · US
Miniaturized multi-part component and method for producing same
US-10076035-B2 · Sep 11, 2018 · US
Radio-frequency package with overmold structure
US-2018198436-A1 · Jul 12, 2018 · US
Electronic component and method of manufacturing the same
US-2018159504-A1 · Jun 7, 2018 · US
Piezoelectric vibrating piece and piezoelectric device
US-2018115301-A1 · Apr 26, 2018 · US
Bulk-acoustic wave filter device
US-2018048291-A1 · Feb 15, 2018 · US
Acoustic wave device, transceiver device, and mobile communication device
US-9887686-B2 · Feb 6, 2018 · US
Bulk acoustic wave filter device and method for manufacturing the same
US-2018019725-A1 · Jan 18, 2018 · US
Bulk acoustic wave filter device and method of manufacturing the same
US-2018013397-A1 · Jan 11, 2018 · US
Wafer level packaging using a transferable structure
US-2017345676-A1 · Nov 30, 2017 · US
Piezoelectric device
US-2017345993-A1 · Nov 30, 2017 · US
Acoustic resonator with electrical interconnect disposed in underlying dielectric
US-9793874-B2 · Oct 17, 2017 · US
Encapsulated bulk acoustic wave (BAW) resonator device
US-9793877-B2 · Oct 17, 2017 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H03H9/1007?
- CPC H03H9/1007 is the Cooperative Patent Classification code for “for bulk acoustic wave [BAW] devices.”
- How many patents are filed under CPC H03H9/1007 (for bulk acoustic wave [BAW] devices)?
- Our database includes 223 publications tagged with this CPC code.
- Is patent activity under CPC H03H9/1007 growing?
- Publication counts under this code: 18 in 2024 vs 14 in 2025 (latest complete years).