Acoustic wave device and method of manufacturing the same

Patent metadata

Field	Value
Publication number	US-10164602-B2
Application number	US-201615190286-A
Country	US
Kind code	B2
Filing date	Jun 23, 2016
Priority date	Sep 14, 2015
Publication date	Dec 25, 2018
Grant date	Dec 25, 2018

Abstract

An acoustic wave device includes a substrate comprising one surface on which an acoustic wave generator and at least one ground pad are included; a support component formed of an insulating material and disposed on the substrate along a circumference of the acoustic wave generator; and a shielding member electrically connected to the ground pad and blocking reception or emission of electromagnetic waves at the acoustic wave generator.

First claim

What is claimed is:

1. An acoustic wave device, comprising:
a substrate comprising one surface on which an acoustic wave generator and at least one ground pad are included;
a support component formed of an insulating material and disposed on the substrate along a circumference of the acoustic wave generator;
a protective member formed of a conductive material and bonded to the support component so as to be spaced apart from the acoustic wave generator by a predetermined distance;
a connection conductor connecting the ground pad and the protective member to each other while penetrating through the support component; and
a sealing component formed on surfaces of the protective member, the support component, and the substrate to serve as a shielding member.

2. The acoustic wave device of claim 1 , wherein the ground pad is formed on one surface of the substrate, disposed outside of the support component, and connected to the connection conductor through a wiring pattern formed on the substrate.

3. The acoustic wave device of claim 1 , wherein a plurality of penetration components are formed in the protective member, the support component is disposed in each of the penetration components, and a connection terminal, connected to the acoustic wave generator, is disposed on a surface of the support component disposed in the penetration component.

4. The acoustic wave device of claim 1 , wherein the ground pad is formed on one surface of the substrate, disposed outside of the support component, and connected to the sealing component.

5. The acoustic wave device of claim 1 , further comprising:
a plurality of connection terminals disposed on at least one surface of the substrate and electrically connected to the acoustic wave generator.

6. The acoustic wave device of claim 1 , further comprising:
an antenna formed on the substrate in a wiring pattern form,
wherein the acoustic wave device is a duplexer.

7. An acoustic wave device, comprising:
a substrate comprising one surface on which an acoustic wave generator and at least one ground pad are included;
a support component formed of an insulating material and disposed on the substrate along a circumference of the acoustic wave generator;
a protective member formed of an insulating material and bonded to the support component so as to be spaced apart from the acoustic wave generator by a predetermined distance, and to form a step portion at ends of the protective member on an upper surface of the support component;
a sealing component formed of a conductive material on surfaces of the protective member, the support component, the step portion, and the substrate; and
a connection conductor connecting the ground pad and the sealing component to each other while penetrating through the protective member and the support component.

8. The acoustic wave device of claim 7 , wherein the sealing component comprises a plurality of bonding components disposed on the support component and a shielding film disposed on regions of the substrate, except for portions on which the bonding components are disposed, and
a connection terminal, electrically connected to the acoustic wave generator, is disposed on the bonding component.

9. The acoustic wave device of claim 8 , further comprising:
a second sealing component formed of an insulating material and disposed on an outer portion of the shielding film.

10. A method of manufacturing an acoustic wave device, the method comprising:
preparing a substrate comprising one surface on which an acoustic wave generator and at least one ground pad are included;
forming, from an insulating material, a support component on the substrate along a circumference of the acoustic wave generator;
forming a protective member on the support component to be spaced apart from the acoustic wave generator by a predetermined distance;
forming a sealing component on surfaces of the support component, the protective member, and the substrate; and
forming at least one connection conductor connecting the protective member, which is formed of a conductive material, and the ground pad to each other in the support component.

11. The method of claim 10 , wherein the forming of the sealing component further comprises:
electrically connecting the sealing component, which is formed of a conductive material, and the ground pad to each other.

12. The method of claim 10 , wherein the forming of the sealing component further comprises:
forming a hole penetrating through the sealing component, which is formed of an insulating material, and the support component to expose the ground pad; and
forming a connection conductor in the hole using a conductive material.

13. An acoustic wave device, comprising:
a substrate comprising one surface on which an acoustic wave generator and at least one ground pad are included;
a support component formed of an insulating material and disposed on the substrate along a circumference of the acoustic wave generator;
a protective member formed of a conductive material and bonded to the support component so as to be spaced apart from the acoustic wave generator by a predetermined distance; and
a penetration component formed in the protective member, the support component is disposed in the penetration component, and a connection terminal, connected to the acoustic wave generator, is disposed on a surface of the support component disposed in the penetration component.

14. An acoustic wave device, comprising:
a substrate comprising one surface on which an acoustic wave generator and at least one ground pad are included;
a support component formed of an insulating material and disposed on the substrate along a circumference of the acoustic wave generator; and
a protective member bonded to the support component so as to be spaced apart from the acoustic wave generator by a predetermined distance;
a sealing component formed on surfaces of the protective member, the support component, and the substrate to serve as a shielding member,
wherein the ground pad is formed on one surface of the substrate, disposed outside of the support component, and connected to the sealing component.

15. An acoustic wave device, comprising:
a substrate comprising one surface on which an acoustic wave generator and at least one ground pad are included;
a support component formed of an insulating material and disposed on the substrate along a circumference of the acoustic wave generator;
a shielding member electrically connected to the ground pad and blocking reception or emission of electromagnetic waves at the acoustic wave generator; and
an antenna formed on the substrate in a wiring pattern form,
wherein the acoustic wave device is a duplexer.

16. A method of manufacturing an acoustic wave device, the method comprising:
preparing a substrate comprising one surface on which an acoustic wave generator and at least one ground pad are included;
forming, from an insulating material, a support component on the substrate along a circumference of the acoustic wave generator;
forming a protective member on the support component to be spaced apart from the acoustic wave generator by a predetermined distance;
forming a sealing component on surfaces of the support component, the protective member, and the substrate; and
forming a hole penetrating through the sealing component, which is formed of an insulating material, and the support component to expose the ground pad; and
forming a connection conductor in the hole using a conductive material.

Assignees

• Samsung Electro Mech

Inventors

• Park Seung Wook
• Romero Christian
• Na Seong Hun
• Jeong Tae Sung

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H01L2924/181

  Electricity · mapped topic

• H03H9/059

  consisting of mounting pads or bumps · CPC title

• H01L2924/15311

  Electricity · mapped topic