Method and apparatus for creating downhole electrical connections
US-12444878-B2 · Oct 14, 2025 · US
comprising preapplied solder · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01R4/022 |
| Official title | {comprising preapplied solder} |
| Display label | comprising preapplied solder |
| Total patents | 37 |
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly declining.
| Year | Patents |
|---|---|
| 2015 | 1 |
| 2016 | 2 |
| 2017 | 5 |
| 2018 | 6 |
| 2019 | 3 |
| 2020 | 7 |
| 2021 | 5 |
| 2022 | 1 |
| 2023 | 3 |
| 2024 | 2 |
| 2025 | 2 |
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
US-12444878-B2 · Oct 14, 2025 · US
US-12418153-B2 · Sep 16, 2025 · US
US-2024396259-A1 · Nov 28, 2024 · US
US-12021343-B2 · Jun 25, 2024 · US
US-2023216260-A1 · Jul 6, 2023 · US
US-2023070488-A1 · Mar 9, 2023 · US
US-11545800-B2 · Jan 3, 2023 · US
US-11344734-B2 · May 31, 2022 · US
US-11198014-B2 · Dec 14, 2021 · US
US-2021328398-A1 · Oct 21, 2021 · US
US-11145995-B2 · Oct 12, 2021 · US
US-11088583-B2 · Aug 10, 2021 · US
US-10992068-B2 · Apr 27, 2021 · US
US-10868372-B2 · Dec 15, 2020 · US
US-10819055-B2 · Oct 27, 2020 · US
US-2020266559-A1 · Aug 20, 2020 · US
US-10571642-B1 · Feb 25, 2020 · US
US-2020059017-A1 · Feb 20, 2020 · US
US-2020030614-A1 · Jan 30, 2020 · US
US-2020014138-A1 · Jan 9, 2020 · US
Answers are generated from the same data shown on this page.