comprising preapplied solder

comprising preapplied solder · Cooperative Patent Classification (CPC)

Electric circuits, power, telecommunications, and semiconductors.

Related technology areas

Mapped technology topics for this CPC code.

CPC classification statistics
MetricValue
CPC codeH01R4/022
Official title{comprising preapplied solder}
Display labelcomprising preapplied solder
Total patents37

Filing trend

Year-over-year patent counts classified under this CPC code.

Filing activity over the last five years is rapidly declining.

Patents filed per year
YearPatents
20151
20162
20175
20186
20193
20207
20215
20221
20233
20242
20252

Representative patents

Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.

Frequently asked questions

Answers are generated from the same data shown on this page.

What is CPC H01R4/022?
CPC H01R4/022 is the Cooperative Patent Classification code for “comprising preapplied solder.”
How many patents are filed under CPC H01R4/022 (comprising preapplied solder)?
Our database includes 37 publications tagged with this CPC code.
Is patent activity under CPC H01R4/022 growing?
Publication counts under this code: 2 in 2024 vs 2 in 2025 (latest complete years).