Method for manufacturing connection body, and connection body

Patent metadata

Field	Value
Publication number	US-12418153-B2
Application number	US-202117797855-A
Country	US
Kind code	B2
Filing date	Jan 29, 2021
Priority date	Feb 7, 2020
Publication date	Sep 16, 2025
Grant date	Sep 16, 2025

Abstract

A method for manufacturing a connection body capable of suppressing deformation of a connector having a terminal array with a narrow pitch and obtaining excellent insulation and conductivity, and the connection body. The method includes: a step of fixing, on a first terminal array of a substrate, via a thermosetting connection material containing solder particles, a connector having a second terminal array having a minimum inter-terminal distance of 0.8 mm or less in the first terminal array and the second terminal array inside a bonding surface to be bonded with the substrate, and a step of joining the first terminal array and the second terminal array without a load by using a reflow furnace set to a temperature equal to or higher than the melting point of the solder particles.

First claim

The invention claimed is:

1. A method for manufacturing a connection body comprising:
a step of fixing, on a first terminal array of a substrate, a connector having a second terminal array having a minimum inter-terminal distance of 0.8 mm or less inside a bonding surface to be bonded with the substrate via a thermosetting connection material containing solder particles; and
a step of joining the first terminal array and the second terminal array without a load by using a reflow furnace set to a temperature equal to or higher than the melting point of the solder particles.

2. The method for manufacturing a connection body according to claim 1 , wherein the ratio of an average particle diameter of the solder particles to a minimum inter-terminal distance in the first terminal array and the second terminal array is less than 0.15.

3. The method for manufacturing a connection body according to claim 1 , wherein in the step of fixing the connector, the connector is pressure bonded at a temperature in a range of −10° C. to +40° C. relative to a minimum melt viscosity reaching temperature of the thermosetting connection material.

4. The method for manufacturing a connection body according to claim 1 , wherein in the step of fixing the connector, the connector is pressure bonded at a pressure of 2.0 MPa or less.

5. The method for manufacturing a connection body according to claim 1 , wherein the connector is a resin molded product.

6. The method for manufacturing a connection body according to claim 1 , wherein the content of the solder particles in the thermosetting connection material is 50 wt % or less.

7. The method for manufacturing a connection body according to claim 1 , wherein the thermosetting connection material is in the form of a film.

8. A connection body, comprising:
a substrate having a first terminal array;
a connector having a second terminal array having a minimum inter-terminal distance of 0.8 mm or less inside a bonding surface to be bonded with the substrate; and
an adhesive layer for joining the first terminal array to the second terminal array with solder particles and bonding the substrate and the connector,
wherein the adhesive layer is a hardened product of a thermosetting connection material having an exothermic peak temperature higher than the melting point of the solder particles and a melting temperature lower than the melting point of the solder particles, and
wherein the substrate has no solder resist between adjacent terminals.

9. The connection body according to claim 8 , wherein the connector has the minimum inter-terminal distance of 0.3 mm or less.

10. The connection body according to claim 8 , wherein the ratio of an average particle diameter of the solder particles to a minimum inter-terminal distance in the first terminal array and the second terminal array is less than 0.15.

11. The method for manufacturing a connection body according to claim 1 , wherein the connector has the minimum inter-terminal distance of 0.3 mm or less.

12. The method for manufacturing a connection body according to claim 1 , wherein the thermosetting connection material has an exothermic peak temperature higher than the melting point of the solder particles and a melting temperature lower than the melting point of the solder particles.

13. The method for manufacturing a connection body according to claim 1 , wherein the substrate has no solder resist between adjacent terminals.

Assignees

• Dexerials Corp

Inventors

• Ito Ryo
• Yamada Yasunobu
• Sato Daisuke

Classifications

• H01R12/57

  surface mounting terminals · CPC title

• H01R4/028

  comprising means for preventing flowing or wicking of solder or flux in parts not desired · CPC title

• H01R4/022

  comprising preapplied solder · CPC title

• H01R12/62

  connecting to rigid printed circuits or like structures · CPC title

• H05K3/32

  electrically connecting electric components or wires to printed circuits · CPC title