Method for manufacturing solder with ground bar and coaxial cable array

Patent metadata

Field	Value
Publication number	US-10992068-B2
Application number	US-202016788147-A
Country	US
Kind code	B2
Filing date	Feb 11, 2020
Priority date	Feb 14, 2019
Publication date	Apr 27, 2021
Grant date	Apr 27, 2021

Abstract

A solder with ground bar includes a first unit and a second unit. The first unit includes a first ground bar and a first solder layer attached to one side of the first ground bar. The second unit includes a second ground bar and a second solder layer attached to one side of the second ground bar. The first unit and the second unit are arranged in such a manner that the first solder layer and the second solder layer face each other. The first solder layer and the second solder layer are partially joined together.

First claim

What is claimed is:

1. A solder with ground bar, comprising:
a first unit including a first ground bar and a first solder layer that is attached to one side of the first ground bar; and
a second unit including a second ground bar and a second solder layer that is attached to one side of the second ground bar,
wherein the first unit and the second unit are arranged in such a manner that the first solder layer and the second solder layer face each other,
wherein a portion of the first solder layer and a portion of the second solder layer are joined together and another portion of the first solder layer and another portion of the second solder layer are not joined together, and
wherein the portion of the first solder layer and the portion of the second solder layer not joined together directly face each other.

2. The solder with ground bar according to claim 1 , wherein the first solder layer and the second solder layer are joined at one or more joint points aligned along a longitudinal direction of the solder with ground bar.

3. The solder with ground bar according to claim 1 , wherein a portion of the first ground bar and a further portion of the first solder layer are joined together and another portion of the first ground bar and yet another portion of the first solder layer are not joined together, and
wherein a portion of the second ground bar and a further portion of the second solder layer are joined together and another portion of the second ground bar and yet another portion of the second solder layer are not joined together.

4. The solder with ground bar according to claim 3 , wherein the portions of the first ground bar and the first solder layer joined together, the portions of the second ground bar and the second solder layer joined together, and the portions of the first solder layer and the second solder layer joined together are at least partially overlapped with each other in a thickness direction of the solder with ground bar.

5. The solder with ground bar according to claim 1 , wherein the portion of the first solder layer and the portion of the second solder layer not joined together extend beyond a range from an end to a center in the longitudinal direction L of the solder with ground bar.

6. The solder with ground bar according to claim 1 , wherein the first ground bar and the first solder layer are entirely joined together, and wherein the second ground bar and the second solder layer are entirely joined together.

7. The solder with ground bar according to claim 1 , wherein in a width direction of the solder with ground bar, a width of the portion of the first solder layer and the portion of the second solder layer joined together is smaller than a width of the solder with ground bar.

8. A method for manufacturing a coaxial cable array by attaching a ground bar to coaxial cables using a solder with ground bar,
wherein the solder with ground bar comprises:
a first unit including a first ground bar and a first solder layer that is attached to one side of the first ground bar, and
a second unit including a second ground bar and a second solder layer that is attached to one side of the second ground bar,
wherein the first unit and the second unit are arranged in such a manner that the first solder layer and the second solder layer face each other,
wherein a portion of the first solder layer and a portion of the second solder layer are joined together and another portion of the first solder layer and another portion of the second solder layer are not joined together,
wherein exposed portions of outer conductors of the coaxial cables are inserted between the portion of the first solder layer and the portion of the second solder layer not joined together, and
wherein the first solder layer and the second solder layer are molten to join the outer conductors with the ground bar.

9. The method for manufacturing the coaxial cable array according to claim 8 , wherein a space between the portion of the first solder layer and the portion of the second solder layer not joined together is expanded by applying a compression force acting in a longitudinal direction L of the solder with ground bar to the solder with ground bar before the coaxial cables are inserted between the portion of the first solder layer and the portion of the second solder layer not joined together.

10. The method for manufacturing the coaxial cable array according to claim 8 , wherein before the coaxial cables are inserted between the portion of the first solder layer and the portion of the second solder layer not joined together, a space expanding unit is inserted between the portion of the first solder layer and the portion of the second solder layer not joined together, and the space expanding unit presses the first solder layer and the second solder layer so as to separate the first solder layer and the second solder layer from each other to expand a space between the portion of the first solder layer and the portion of the second solder layer not joined together.

11. A solder with ground bar, comprising:
a first unit including a first ground bar and a first solder layer that is attached to one side of the first ground bar; and
a second unit including a second ground bar and a second solder layer that is attached to one side of the second ground bar,
wherein the first unit and the second unit are arranged in such a manner that the first solder layer and the second solder layer face each other,
wherein a portion of the first solder layer and a portion of the second solder layer are joined together and another portion of the first solder layer and another portion of the second solder layer are not joined together,
wherein a portion of the first ground bar and a further portion of the first solder layer are joined together and another portion of the first ground bar and yet another portion of the first solder layer are not joined together, and
wherein a portion of the second ground bar and a further portion of the second solder layer are joined together and another portion of the second ground bar and yet another portion of the second solder layer are not joined together.

12. The solder with ground bar according to claim 11 , wherein the portions of the first ground bar and the first solder layer joined together, the portions of the second ground bar and the second solder layer joined together, and the portions of the first solder layer and the second solder layer joined together are at least partially overlapped with each other in a thickness direction of the solder with ground bar.

Assignees

• Hitachi Metals Ltd

Inventors

• Suzuki Kanako
• Okoshi mikio
• Shirakawa Yohei
• Ageishi Yoshitake

Classifications

• H01R4/66

  Connections with the terrestrial mass, e.g. earth plate, earth pin · CPC title

• H01R4/021

  between two or more cables or wires · CPC title

• H01R4/022

  comprising preapplied solder · CPC title

• H01R43/0249 Primary

  for simultaneous welding or soldering of a plurality of wires to contact elements · CPC title

• B23K35/0227

  Rods or wires (B23K35/0244 takes precedence) · CPC title