Method for manufacturing a monocrystalline piezoelectric layer
US-11600766-B2 · Mar 7, 2023 · US
Electricity
Electricity · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01L41/335 |
| Official title | — |
| Display label | Electricity (mapped technology topic) |
| Total patents | 42 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2016 | 4 |
| 2017 | 3 |
| 2018 | 8 |
| 2019 | 6 |
| 2020 | 9 |
| 2021 | 6 |
| 2022 | 3 |
| 2023 | 3 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Ultrasonic sensor, ultrasonic device, and method of manufacturing ultrasonic sensor
US-11590534-B2 · Feb 28, 2023 · US
Variable thickness diaphragm for a wideband robust piezoelectric micromachined ultrasonic transducer (pmut)
US-2023053609-A1 · Feb 23, 2023 · US
Method for separating a removable composite structure by means of a light flux
US-11469367-B2 · Oct 11, 2022 · US
Variable thickness diaphragm for a wideband robust piezoelectric micromachined ultrasonic transducer (PMUT)
US-11462677-B2 · Oct 4, 2022 · US
Piezoelectric vibration element, piezoelectric resonator unit, and electronic device
US-2022278268-A1 · Sep 1, 2022 · US
Use of an electric field for detaching a piezoelectric layer from a donor substrate
US-2021376225-A1 · Dec 2, 2021 · US
Method of manufacturing substrate for acoustic wave device
US-11165408-B2 · Nov 2, 2021 · US
Method for producing a plurality of piezoelectric multilayer components
US-11024794-B2 · Jun 1, 2021 · US
Piezoelectric element for an automatic frequency control circuit, oscillating mechanical system and device comprising the same, and method for manufacturing the piezoelectric element
US-10983479-B2 · Apr 20, 2021 · US
Substrate for a temperature-compensated surface acoustic wave device or volume acoustic wave device
US-10924081-B2 · Feb 16, 2021 · US
Method for separating a removable composite structure by means of a light flux
US-2021028348-A1 · Jan 28, 2021 · US
Method for producing composite wafer having oxide single-crystal film
US-10770648-B2 · Sep 8, 2020 · US
Method for producing composite wafer having oxide single-crystal film
US-10727396-B2 · Jul 28, 2020 · US
Substrate for a temperature-compensated surface acoustic wave device or volume acoustic wave device
US-2020228088-A1 · Jul 16, 2020 · US
Variable thickness diaphragm for a wideband robust piezoelectric micromachined ultrasonic transducer (pmut)
US-2020194661-A1 · Jun 18, 2020 · US
Method for producing ceramic multi-layer components
US-10686120-B2 · Jun 16, 2020 · US
Substrate for a temperature-compensated surface acoustic wave device or volume acoustic wave device
US-10608610-B2 · Mar 31, 2020 · US
Piezoelectric element having improved sensitivity, method for manufacturing the same and piezoelectric sensor
US-10545059-B2 · Jan 28, 2020 · US
Manufacturing method of vibrator
US-10541630-B2 · Jan 21, 2020 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H01L41/335?
- CPC H01L41/335 is the Cooperative Patent Classification code for “Electricity.”
- How many patents are filed under CPC H01L41/335 (Electricity)?
- Our database includes 42 publications tagged with this CPC code.
- Is patent activity under CPC H01L41/335 growing?
- Publication counts under this code: 3 in 2022 vs 3 in 2023 (latest complete years).