Piezoelectric transformer
US-2017208675-A1 · Jul 20, 2017 · US
Method for producing a plurality of piezoelectric multilayer components
US11024794B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11024794-B2 |
| Application number | US-201716306512-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 31, 2017 |
| Priority date | Jun 2, 2016 |
| Publication date | Jun 1, 2021 |
| Grant date | Jun 1, 2021 |
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Abstract
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A method for producing a plurality of piezoelectric multilayer components is disclosed. In an embodiment, a method for producing a plurality of piezoelectric multilayer components includes grinding the piezoelectric multilayer components without an addition of an abrasive by rubbing the piezoelectric multilayer components against one another so that a material abrasion of the piezoelectric multilayer components is carried out.
First claim
Opening claim text (preview).
The invention claimed is: 1. A method for producing a plurality of piezoelectric multilayer components, the method comprising: grinding the piezoelectric multilayer components without an addition of an abrasive by rubbing the piezoelectric multilayer components against one another so that a material abrasion of the piezoelectric multilayer components is carried out, wherein grinding the piezoelectric multilayer components is carried out in a drum loaded with the plurality of the piezoelectric multilayer components, and wherein the material abrasion is set by setting a number of piezoelectric multilayer components in the drum; and performing a heat treatment process in which the piezoelectric multilayer components are exposed to an elevated temperature before grinding the piezoelectric multilayer components, wherein, while performing the heat treatment process, a polymer of a binder is not decomposed, and wherein the heat treatment process is carried out under reduced pressure. 2. The method according to claim 1 , wherein the piezoelectric multilayer components are ground as green bodies. 3. The method according to claim 1 , further comprising sintering the piezoelectric multilayer components after grinding the piezoelectric multilayer components. 4. The method according to claim 1 , wherein a hardness of the piezoelectric multilayer components is increased during the heat treatment process. 5. The method according to claim 1 , further comprising at least partly removing a solvent and/or plasticizers of an organic binder from the piezoelectric multilayer components during the heat treatment process. 6. The method according to claim 1 , wherein the elevated temperature is a temperature between 100° C. to 150° C. inclusive. 7. The method according to claim 1 , wherein the material abrasion is further set by setting at least one of a running time of the grinding of the piezoelectric multilayer components or a rotational speed of the drum. 8. The method according to claim 1 , wherein grinding the piezoelectric multilayer components comprises grinding the piezoelectric multilayer components by surrounding them with water. 9. The method according to claim 1 , wherein the piezoelectric multilayer components are piezoelectric transformers. 10. The method according to claim 1 , wherein the piezoelectric multilayer components are capacitors. 11. A method for producing a plurality of piezoelectric multilayer components, the method comprising: grinding the piezoelectric multilayer components without an addition of an abrasive by rubbing the piezoelectric multilayer components against one another so that a material abrasion of the piezoelectric multilayer components is carried out, wherein the grinding the piezoelectric multilayer components comprises grinding the piezoelectric multilayer components by surrounding them with water, and wherein soap is added to the water prior to the grinding; and performing a heat treatment process in which the piezoelectric multilayer components are exposed to an elevated temperature before grinding the piezoelectric multilayer components, wherein, while performing the heat treatment process, a polymer of a binder is not decomposed, and wherein the heat treatment process is carried out under reduced pressure.
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Classifications
- H01L41/0835Primary
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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- What does patent US11024794B2 cover?
- A method for producing a plurality of piezoelectric multilayer components is disclosed. In an embodiment, a method for producing a plurality of piezoelectric multilayer components includes grinding the piezoelectric multilayer components without an addition of an abrasive by rubbing the piezoelectric multilayer components against one another so that a material abrasion of the piezoelectric mult…
- Who is the assignee on this patent?
- Tdk Electronics Ag
- What technology area does this patent fall under?
- Primary CPC classification H01L41/0835. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Jun 01 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).