Method for producing ceramic multi-layer components

Patent metadata

Field	Value
Publication number	US-10686120-B2
Application number	US-201414913367-A
Country	US
Kind code	B2
Filing date	Jul 14, 2014
Priority date	Aug 27, 2013
Publication date	Jun 16, 2020
Grant date	Jun 16, 2020

Abstract

A method can be used for producing ceramic multilayer components. The method includes providing green layers for the ceramic multilayer components, stacking the green layers into a stack, and subsequently compressing the stack to form a block. Furthermore, the method includes isolating the block into partial blocks that each have a longitudinal direction, thermally treating the partial blocks, subsequently mechanically machining surfaces of the partial blocks, and providing the partial blocks with outer electrodes and isolating the partial blocks in each case transversely to the longitudinal direction into individual ceramic multilayer components.

First claim

The invention claimed is:

1. A method for producing ceramic multilayer components, the method comprising:
providing green layers with inner electrode layers for the ceramic multilayer components;
stacking the green layers into a stack and subsequently compressing the stack to form a block;
separating the block into partial blocks, each of the partial blocks having a longitudinal direction;
thermally treating the partial blocks, wherein thermally treating comprises decarbonizing the partial blocks under reduced oxygen partial pressure;
mechanically machining by grinding surfaces of the partial blocks after thermally treating, wherein mechanically machining of the surfaces comprises grinding opposite lateral surfaces, a surface of a bottom side and a surface of a top side of each of the partial blocks;
providing the partial blocks with outer electrodes; and
separating the partial blocks into individual ceramic multilayer components, each of the partial blocks being isolated transversely to the longitudinal direction,
wherein, after separating the partial blocks into the individual ceramic multilayer components, no further machining by grinding is performed,
wherein each individual ceramic multilayer component is a piezoelectric multilayer component, and
wherein the inner electrode layers are copper electrode layers.

2. The method according to claim 1 , wherein the outer electrodes are copper electrodes.

3. The method according to claim 1 , wherein stacking the green layers comprises stacking the green layers with the inner electrode layers, some of the inner electrode layers being electrically coupled to a first electrode of the outer electrodes and others of the inner electrode layers being electrically coupled to a second electrode of the outer electrodes.

4. The method according to claim 1 , wherein separating the block into the partial blocks comprises cutting the block only once transversely to the longitudinal direction of the block.

5. The method according to claim 1 , wherein separating the block into the partial blocks comprises cutting the block multiple times transversely to the longitudinal direction of the block.

6. The method according to claim 1 , wherein separating the block into the partial blocks comprises cutting the block more often in parallel to the longitudinal direction of the block than transversely to the longitudinal direction of the block.

7. The method according to claim 1 , wherein the opposite lateral surfaces of the partial blocks are provided with the outer electrodes.

8. The method according to claim 1 , wherein, after providing the partial blocks with the outer electrodes, the method further comprises providing the partial blocks with an outer contact.

9. The method according to claim 8 , wherein the outer contact is provided by a solder or by a soldering process.

10. A method for producing ceramic multilayer components, the method comprising:
providing green layers with inner electrode layers for the ceramic multilayer components;
stacking the green layers into a stack and subsequently compressing the stack to form a block;
separating the block into partial blocks, each of the partial blocks having a longitudinal direction;
thermally treating the partial blocks, wherein thermally treating comprises decarbonizing the partial blocks under reduced oxygen partial pressure;
mechanically machining by grinding surfaces of the partial blocks after thermally treating, wherein mechanically machining of the surfaces comprises grinding opposite lateral surfaces, a surface of a bottom side and a surface of a top side of each of the partial blocks;
providing the partial blocks with outer electrodes; and
separating the partial blocks into individual ceramic multilayer components, each of the partial blocks being isolated transversely to the longitudinal direction, wherein, after separating the partial blocks into the individual ceramic multilayer components, no further machining by grinding is performed,
wherein the inner electrode layers are copper electrode layers, and
wherein each individual ceramic multilayer component is a piezoelectric actuator.

11. A method for producing ceramic multilayer components, the method comprising:
providing green layers with inner electrode layers for the ceramic multilayer components;
stacking the green layers into a stack and subsequently compressing the stack to form a block;
separating the block into partial blocks, each of the partial blocks having a longitudinal direction;
thermally treating the partial blocks, wherein thermally treating comprises decarbonizing the partial blocks under reduced oxygen partial pressure;
mechanically machining by grinding surfaces of the partial blocks after thermally treating, wherein mechanically machining of the surfaces comprises grinding opposite lateral surfaces, a surface of a bottom side and a surface of a top side of each of the partial blocks;
providing the partial blocks with outer electrodes; and
separating the partial blocks into individual ceramic multilayer components, each of the partial blocks being isolated transversely to the longitudinal direction,
wherein, after separating the partial blocks into the individual ceramic multilayer components, no further machining by grinding is performed,
wherein the inner electrode layers are copper electrode layers, and
wherein each individual ceramic multilayer component is a multilayer capacitor.

12. The method according to claim 11 , wherein the outer electrodes are copper electrodes.

13. The method according to claim 11 , wherein stacking the green layers comprises stacking the green layers with the inner electrode layers, some of the inner electrode layers being electrically coupled to a first electrode of the outer electrodes and others of the inner electrode layers being electrically coupled to a second electrode of the outer electrodes.

14. The method according to claim 11 , wherein separating the block into the partial blocks comprises cutting the block only once transversely to the longitudinal direction of the block.

15. The method according to claim 11 , wherein separating the block into the partial blocks comprises cutting the block multiple times transversely to the longitudinal direction of the block.

16. The method according to claim 11 , wherein separating the block into the partial blocks comprises cutting the block more often in parallel to the longitudinal direction of the block than transversely to the longitudinal direction of the block.

17. The method according to claim 11 , wherein the opposite lateral surfaces of the partial blocks are provided with the outer electrodes.

18. The method according to claim 11 , wherein, after providing the partial blocks with the outer electrodes, the method further comprises providing the partial blocks with an outer contact.

Assignees

• Epcos Ag

Inventors

• Ottlinger Marion
• Krumphals Robert
• Glazunov Alexander

Classifications

• H01G4/30 Primary

  Stacked capacitors (H01G4/33 takes precedence) · CPC title

• H10N30/053 Primary

  by integrally sintering piezoelectric or electrostrictive bodies and electrodes · CPC title

• H10N30/87

  Electrodes or interconnections, e.g. leads or terminals · CPC title

• H10N30/508

  adapted for alleviating internal stress, e.g. cracking control layers · CPC title

• H10N30/50

  having a stacked or multilayer structure · CPC title