Electromechanical transducer and method of producing the same
US-9525121-B2 · Dec 20, 2016 · US
Electricity
Electricity · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01L41/332 |
| Official title | — |
| Display label | Electricity (mapped technology topic) |
| Total patents | 370 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 25 |
| 2016 | 43 |
| 2017 | 42 |
| 2018 | 60 |
| 2019 | 53 |
| 2020 | 49 |
| 2021 | 37 |
| 2022 | 38 |
| 2023 | 23 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Piezoelectric thin film element, method for manufacturing the same, and electronic device including piezoelectric thin film element
US-2016365504-A1 · Dec 15, 2016 · US
Piezoelectric thin film, piezoelectric thin film device, target, and methods for manufacturing piezoelectric thin film and piezoelectric thin film device
US-2016365503-A1 · Dec 15, 2016 · US
High frequency piezoelectric crystal composites, devices, and methods for manufacturing the same
US-9519269-B2 · Dec 13, 2016 · US
Fabrication and self-aligned local functionalization of nanocups and various plasmonic nanostructures on flexible substrates for implantable and sensing applications
US-9512000-B2 · Dec 6, 2016 · US
Condensation inhibiting layer, method of forming the layer, and condensation inhibiting device
US-9507145-B2 · Nov 29, 2016 · US
Mems-based cantilever energy harvester
US-2016322559-A1 · Nov 3, 2016 · US
Methods for dry etching semiconductor devices
US-9484216-B1 · Nov 1, 2016 · US
High-temperature isotropic plasma etching process to prevent electrical shorts
US-2016313627-A1 · Oct 27, 2016 · US
Variable thickness diaphragm for a wideband robust piezoelectric micromachined ultrasonic transducer (pmut)
US-2016315247-A1 · Oct 27, 2016 · US
Method for manufacturing a piezoelectric film wafer, piezoelectric film element, and piezoelectric film device
US-2016308111-A1 · Oct 20, 2016 · US
Method for Manufacturing Niobate-System Ferroelectric Thin Film Device
US-2016284975-A1 · Sep 29, 2016 · US
Self-limited crack etch to prevent device shorting
US-2016248001-A1 · Aug 25, 2016 · US
Method for fabricating a pressure sensor
US-2016238467-A1 · Aug 18, 2016 · US
Method for manufacturing a piezoelectric film wafer, piezolelectric film element, and piezoelectric film device
US-9406867-B2 · Aug 2, 2016 · US
Manufacturing method for piezoelectric resonator device
US-9406868-B2 · Aug 2, 2016 · US
Vibration element manufacturing method, vibration element, electronic device, electronic apparatus, and moving object
US-2016204334-A1 · Jul 14, 2016 · US
MEMs-based cantilever energy harvester
US-9388041-B2 · Jul 12, 2016 · US
Method for manufacturing niobate-system ferroelectric thin film device
US-9385297-B2 · Jul 5, 2016 · US
Acoustic wave device structure, integrated structure of power amplifier and acoustic wave device, and fabrication methods thereof
US-2016190206-A1 · Jun 30, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H01L41/332?
- CPC H01L41/332 is the Cooperative Patent Classification code for “Electricity.”
- How many patents are filed under CPC H01L41/332 (Electricity)?
- Our database includes 370 publications tagged with this CPC code.
- Is patent activity under CPC H01L41/332 growing?
- Publication counts under this code: 38 in 2022 vs 23 in 2023 (latest complete years).