Flux, substrate and manufacturing method, and device
US-2024282737-A1 · Aug 22, 2024 · US
Electricity
Electricity · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01L24/95 |
| Official title | — |
| Display label | Electricity (mapped technology topic) |
| Total patents | 878 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is growing.
| Year | Patents |
|---|---|
| 2015 | 39 |
| 2016 | 46 |
| 2017 | 56 |
| 2018 | 52 |
| 2019 | 91 |
| 2020 | 101 |
| 2021 | 81 |
| 2022 | 103 |
| 2023 | 82 |
| 2024 | 98 |
| 2025 | 101 |
| 2026 | 28 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Component-embedded resin substrate
US-9526176-B2 · Dec 20, 2016 · US
Micro device transfer head heater assembly and method of transferring a micro device
US-9463613-B2 · Oct 11, 2016 · US
Method of producing a large number of support apparatus which can be surface-mounted, arrangement of a large number of support apparatus which can be surface-mounted, and support apparatus which can be surface-mounted
US-2016268186-A1 · Sep 15, 2016 · US
Semiconductor device with mechanical lock features between a semiconductor die and a substrate
US-9425161-B2 · Aug 23, 2016 · US
Display device using semiconductor light emitting device
US-9423832-B2 · Aug 23, 2016 · US
Compliant electrostatic transfer head with spring support layer
US-9425151-B2 · Aug 23, 2016 · US
Apparatus for fluid guided self-assembly of microcomponents
US-9408312-B2 · Aug 2, 2016 · US
Semiconductor border protection sealant
US-9390993-B2 · Jul 12, 2016 · US
Build-up package for integrated circuit devices, and methods of making same
US-9355994-B2 · May 31, 2016 · US
Printable composition of a liquid or gel suspension of diodes
US-9343593-B2 · May 17, 2016 · US
Semiconductor device manufacturing method and semiconductor device
US-9331042-B2 · May 3, 2016 · US
Light-emitting device manufacturing method, light-emitting device, lighting device, backlight, liquid-crystal panel, display device, display device manufacturing method, display device drive method and liquid-crystal display device
US-9329433-B2 · May 3, 2016 · US
Power module and method of manufacturing the power module
US-9306020-B2 · Apr 5, 2016 · US
Ultra-thin printed LED layer removed from substrate
US-9299887-B2 · Mar 29, 2016 · US
Apparatus for manufacturing a hierarchical structure
US-9281230-B2 · Mar 8, 2016 · US
Three-terminal printed devices interconnected as circuits
US-9275978-B2 · Mar 1, 2016 · US
Semiconductor device and method of forming prefabricated heat spreader frame with embedded semiconductor die
US-9257357-B2 · Feb 9, 2016 · US
Light emitting diodes and a method of packaging the same
US-9245875-B2 · Jan 26, 2016 · US
Method for integrating a light emitting device
US-9240397-B2 · Jan 19, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H01L24/95?
- CPC H01L24/95 is the Cooperative Patent Classification code for “Electricity.”
- How many patents are filed under CPC H01L24/95 (Electricity)?
- Our database includes 878 publications tagged with this CPC code.
- Is patent activity under CPC H01L24/95 growing?
- Publication counts under this code: 98 in 2024 vs 101 in 2025 (latest complete years).