Component-embedded resin substrate

Patent metadata

Field	Value
Publication number	US-9526176-B2
Application number	US-201414246682-A
Country	US
Kind code	B2
Filing date	Apr 7, 2014
Priority date	Oct 14, 2011
Publication date	Dec 20, 2016
Grant date	Dec 20, 2016

Abstract

A component-embedded resin substrate includes a resin structure including a plurality of laminated resin layers and having an end surface surrounding an outer periphery of the resin layers and a plurality of embedded components arranged as embedded in the resin structure. The plurality of embedded components include a first embedded component and a second embedded component. When viewed in a planar view, the first embedded component has a first outer side extending along a portion of an end surface 5 closest to the first embedded component. When viewed in a planar view, the second embedded component has a second outer side extending along a portion of the end surface closest to the second embedded component. When viewed in a planar view, the outer side is oblique to the second outer side.

First claim

The invention claimed is:

1. A component-embedded resin substrate, comprising:
a resin structure including a plurality of laminated resin layers and having an end surface surrounding an outer periphery of said resin layers; and
a plurality of embedded components arranged as embedded in said resin structure,
said plurality of embedded components including a first embedded component and a second embedded component,
said first embedded component having a first outer side extending along a first portion of said end surface closest to said first embedded component when viewed in a planar view,
said second embedded component having a second outer side extending along a second portion of said end surface closest to said second embedded component when viewed in a planar view,
said first outer side being oblique to said second outer side when viewed in a planar view,
said resin structure having an irregular shape when viewed in a planar view, and
said first portion of said end surface being oblique to said second portion of said end surface,
wherein each of said plurality of embedded components is arranged in parallel to said end surface closest to said embedded component, and
wherein said end surface closest to said first embedded component has a straight portion not shorter than said first outer side, and said end surface closest to said second embedded component has a straight portion not shorter than said second outer side.

2. The component-embedded resin substrate according to claim 1 , wherein
said first embedded component and said second embedded component are each in a rectangular shape having a long side and a short side when viewed in a planar view, said first outer side is a short side of said first embedded component, and said second outer side is a short side of said second embedded component.

3. The component-embedded resin substrate according to claim 1 , further comprising one or more surface mount components placed on a surface of said resin structure and having a rectangular shape with a long side and a short side when viewed in a planar view, wherein
an embedded component of said plurality of embedded components having a shortest three-dimensional distance to at least a portion of said surface mount component is defined as a closest embedded component, said closest embedded component is in a rectangular shape having a long side and a short side when viewed in a planar view, and a long side of said closest embedded component extends in a direction different from a long side of said surface mount component when viewed in a planar view.

4. The component-embedded resin substrate according to claim 3 ,
wherein the long side of said closest embedded component is oblique to the long side of said surface mount component when viewed in a planar view.

Assignees

• Murata Manufacturing Co

Inventors

• Sakai Norio
• Otsubo Yoshihito

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/0198

  batch processes · CPC title

• H10W72/00

  Interconnections or connectors in packages · CPC title

• H10W70/685 Primary

  comprising multiple insulating layers · CPC title

• H05K1/183 Primary

  associated with components mounted in and supported by recessed areas of the PCBs · CPC title