Build-up package for integrated circuit devices, and methods of making same

Patent metadata

Field	Value
Publication number	US-9355994-B2
Application number	US-201414307238-A
Country	US
Kind code	B2
Filing date	Jun 17, 2014
Priority date	Jun 26, 2007
Publication date	May 31, 2016
Grant date	May 31, 2016

Abstract

A device is disclosed which includes, in one illustrative example, an integrated circuit die having an active surface and a molded body extending around a perimeter of the die, the molded body having lips that are positioned above a portion of the active surface of the die. Another illustrative example includes an integrated circuit die having an active surface, a molded body extending around a perimeter of the die and a CTE buffer material formed around at least a portion of the perimeter of the die adjacent the active surface of the die, wherein the CTE buffer material is positioned between a portion of the die and a portion of the molded body and wherein the CTE buffer material has a coefficient of thermal expansion that is intermediate a coefficient of thermal expansion for the die and a coefficient of thermal expansion for the molded body.

First claim

What is claimed:

1. A method, comprising:
positioning a die on a tape with an active surface of the die facing the tape;
molding a buffer material around at least a portion of a perimeter of the die and contacting the tape;
forming a molded body around the die and the buffer material, wherein the die has a first coefficient of thermal expansion (CTE), the buffer material has a second CTE, and the molded body has a third CTE, and wherein the second CTE is intermediate to the first CTE and the third CTE; and
wherein forming the molded body includes forming the molded body on a back surface of the die.

2. The method of claim 1 wherein positioning the die on the tape comprises positioning a plurality of dies on the tape, the method further comprising singulating the dies.

3. The method of claim 1 , further comprising removing the tape from the die, and temporarily positioning the die on a second tape with a backside of the die contacting the second tape.

4. The method of claim 1 , further comprising forming an insulating material over a portion of the active surface with at least a portion of a bond pad exposed on the active surface.

5. The method of claim 4 , further comprising forming a conductive material on the insulating material and electrically connected to the bond pad on the active surface.

6. The method of claim 4 wherein molding a buffer material comprises forming a buffer material with a triangular cross-section against the tape and the die.

7. The method of claim 1 wherein forming the molded body around the die and the buffer material includes forming the molded body around the die and the buffer material via compression molding.

8. The method of claim 1 wherein the molded body is an encapsulant material.

9. The method of claim 1 wherein the molded body is an encapsulant material, and wherein forming the molded body around the die and the buffer material includes embedding the die and the buffer material in the encapsulant material.

10. The method of claim 1 , further comprising removing a portion of the molded body from above a back surface of the die.

11. The method of claim 1 wherein forming the molded body includes forming the molded body on the buffer material.

12. The method of claim 1 wherein molding a buffer material includes molding the buffer material around at least a portion of a perimeter of the die such that the buffer material has a maximum thickness that is approximately one-half a thickness of the die.

13. The method of claim 1 wherein molding a buffer material includes molding the buffer material around at least a portion of a perimeter of the die such that the buffer material directly contacts at least a portion of the perimeter of the die.

14. The method of claim 1 wherein molding a buffer material around at least a portion of the perimeter of the die includes molding the buffer material such that the buffer material has a portion contacting the die that has a thickness that is approximately one-half a thickness of the die.

15. A method comprising:
positioning a die on a tape with an active surface of the die facing the tape;
molding a buffer material around at least a portion of a perimeter of the die and contacting the tape;
forming a molded body around the die and the buffer material, wherein the die has a first coefficient of the thermal expansion (CTE), the buffer material has a second CTE, and a the molded body has a third CTE, and wherein the second CTE is intermediate to the first CTE and the third CTE; and
wherein molding the buffer material occurs before forming the molded body.

16. A method, comprising:
positioning a die on a tape with an active surface of the die facing the tape;
molding a buffer material around at least a portion of a perimeter of the die and contacting the tape;
forming a molded body around the die and the buffer material, wherein the die has a first coefficient of thermal expansion (CTE), the buffer material has a second CTE, and the molded body has a third CTE, and wherein the second CTE is intermediate to the first CTE and the third CTE; and
wherein forming the molded body around the die and the buffer material includes forming the molded body around the die and the buffer material via compression molding.

17. A method, comprising:
positioning a die on a tape with an active surface of the die facing the tape;
molding a buffer material around at least a portion of a perimeter of the die and contacting the tape;
forming a molded body around the die and the buffer material, wherein the die has a first coefficient of thermal expansion (CTE), the buffer material has a second CTE, and the molded body has a third CTE, and wherein the second CTE is intermediate to the first CTE and the third CTE; and
removing a portion of the molded body from above a back surface of the die.

18. The method of claim 17 wherein positioning the die on the tape comprises positioning a plurality of dies on the tape, the method further comprising singulating the dies.

19. The method of claim 17 , further comprising removing the tape from the die, and temporarily positioning the die on a second tape with a backside of the die contacting the second tape.

20. The method of claim 17 , further comprising forming an insulating material over a portion of the active surface with at least a portion of a bond pad exposed on the active surface.

21. The method of claim 17 wherein forming the molded body around the die and the buffer material includes forming the molded body around the die and the buffer material via compression molding.

22. The method of claim 17 wherein the molded body is an encapsulant material.

23. The method of claim 17 wherein the molded body is an encapsulant material, and wherein forming the molded body around the die and the buffer material includes embedding the die and the buffer material in the encapsulant material.

24. The method of claim 17 wherein molding a buffer material includes molding the buffer material around at least a portion of a perimeter of the die such that the buffer material directly contacts at least a portion of the perimeter of the die.

Assignees

• Ng Hong Wan
• Lee Choon Kuan
• Corisis David J
• Chong Chin Hui
• Micron Technology Inc

Inventors

• Ng Hong Wan
• Lee Choon Kuan
• Corisis David J
• Chong Chin Hui

Classifications

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W74/142

  the encapsulations exposing the passive side of the semiconductor body · CPC title

• H10W72/9445

  Top-view layouts, e.g. mirror arrays · CPC title

• H10W72/952

  comprising metals or metalloids, e.g. PbSn, Ag or Cu · CPC title

• H10W72/9415

  relative to the surface, e.g. recessed, protruding · CPC title