Light emitting device
US-2017301837-A1 · Oct 19, 2017 · US
Electricity
Electricity · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01L2224/48471 |
| Official title | — |
| Display label | Electricity (mapped technology topic) |
| Total patents | 211 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is growing.
| Year | Patents |
|---|---|
| 2015 | 29 |
| 2016 | 29 |
| 2017 | 28 |
| 2018 | 35 |
| 2019 | 22 |
| 2020 | 21 |
| 2021 | 8 |
| 2022 | 7 |
| 2023 | 9 |
| 2024 | 7 |
| 2025 | 13 |
| 2026 | 3 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Light emitting device
US-2017250326-A1 · Aug 31, 2017 · US
Mounting block and a mounting assembly that incorporates the mounting block
US-9521742-B2 · Dec 13, 2016 · US
Stacked microfeature devices and associated methods
US-9515046-B2 · Dec 6, 2016 · US
Housing for an electronic component, an electronic assembly, method of producing a housing for an electronic component and method of producing an electronic assembly
US-9515015-B2 · Dec 6, 2016 · US
Semiconductor device including semiconductor chips stacked via relay substrate
US-9508670-B2 · Nov 29, 2016 · US
Package-on-package type semiconductor device including fan-out memory package
US-2016329298-A1 · Nov 10, 2016 · US
Semiconductor device
US-9490194-B2 · Nov 8, 2016 · US
Encapsulated component comprising a MEMS component and method for the production thereof
US-9481565-B2 · Nov 1, 2016 · US
Semiconductor device provided with direction sensor elements
US-9476949-B2 · Oct 25, 2016 · US
Optoelectronic component
US-2016308102-A1 · Oct 20, 2016 · US
Semiconductor integrated circuit device
US-9466559-B2 · Oct 11, 2016 · US
Wire loops, methods of forming wire loops, and related processes
US-9455544-B2 · Sep 27, 2016 · US
Optoelectronic semiconductor chip, optoelectronic semiconductor component, and a method for producing an optoelectronic semiconductor component
US-9444022-B2 · Sep 13, 2016 · US
Protection devices
US-9437589-B2 · Sep 6, 2016 · US
Multi-chip package assembly with improved bond wire separation
US-9431364-B2 · Aug 30, 2016 · US
Leadless chip carrier having improved mountability
US-9418919-B2 · Aug 16, 2016 · US
Integrated RF front end system
US-9419073-B2 · Aug 16, 2016 · US
Component in the form of a wafer level package and method for manufacturing same
US-9406747-B2 · Aug 2, 2016 · US
Method of manufacturing semiconductor device
US-9397072-B2 · Jul 19, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H01L2224/48471?
- CPC H01L2224/48471 is the Cooperative Patent Classification code for “Electricity.”
- How many patents are filed under CPC H01L2224/48471 (Electricity)?
- Our database includes 211 publications tagged with this CPC code.
- Is patent activity under CPC H01L2224/48471 growing?
- Publication counts under this code: 7 in 2024 vs 13 in 2025 (latest complete years).