Stacked microfeature devices and associated methods

Patent metadata

Field	Value
Publication number	US-9515046-B2
Application number	US-201313845953-A
Country	US
Kind code	B2
Filing date	Mar 18, 2013
Priority date	Aug 29, 2003
Publication date	Dec 6, 2016
Grant date	Dec 6, 2016

Abstract

Stacked microfeature devices and associated methods of manufacture are disclosed. A package in accordance with one embodiment includes first and second microfeature devices having corresponding first and second bond pad surfaces that face toward each other. First bond pads can be positioned at least proximate to the first bond pad surface and second bond pads can be positioned at least proximate to the second bond pad surface. A package connection site can provide electrical communication between the first microfeature device and components external to the package. A wirebond can be coupled between at least one of the first bond pads and the package connection site, and an electrically conductive link can be coupled between the first microfeature device and at least one of the second bond pads of the second microfeature device. Accordingly, the first microfeature device can form a portion of an electrical link to the second microfeature device.

First claim

We claim:

1. A method for forming a microfeature device package, comprising:
positioning a first microfeature device at least proximate to a second microfeature device, the first microfeature device having a first bond pad surface with a first bond pad, the second microfeature device having a second bond pad surface with a second bond pad and an intermediate bond pad electrically connected to the second bond pad, the first bond pad surface facing toward the second bond pad surface;
coupling a wirebond between the first bond pad and a package connection site; and
disposing an electrically conductive member between the first bond pad and the intermediate bond pad.

2. The method of claim 1 wherein disposing the electrically conductive member includes disposing a volume of solder between the first bond pad and the intermediate bond pad.

3. The method of claim 1 wherein disposing the electrically conductive member includes disposing at least one of a gold stud bump, a copper stud bump, and a solder bump.

4. The method of claim 1 , further comprising physically and electrically bonding the intermediate bond pad to the first bond pad and/or to a portion of the wirebond.

5. The method of claim 1 , further comprising disposing an encapsulant adjacent to the first and second microfeature devices.

6. The method of claim 1 wherein the first microfeature device is generally similar to the second microfeature device, and wherein positioning the first microfeature device includes stacking the first microfeature device on top of the second microfeature device.

7. The method of claim 1 , further comprising providing electrical communication between the second bond pad and components external to the device package via the first bond pad, the intermediate bond pad, and the electrically conductive member.

8. A method for forming a microfeature device package, comprising:
stacking a first microfeature device with a second microfeature device, the first microfeature device having a first bond pad surface with a plurality of first bond pads, first intermediate bond pads and first couplers, with individual first intermediate bond pads being spaced apart from and electrically coupled to corresponding individual first bond pads via corresponding individual first couplers and the second microfeature device having a second bond pad surface with a plurality of second bond pads and second intermediate bond pads, wherein the second bond pad surface faces toward the first bond pad surface;
coupling individual wirebonds between the individual first intermediate bond pads and corresponding package connection sites; and
disposing individual electrically conductive members between the individual first intermediate bond pads and corresponding individual second intermediate bond pads.

9. The method of claim 8 , further comprising aligning the individual first and second intermediate bond pads with each other.

10. The method of claim 8 wherein the first intermediate bond pads are not electrically connected to features within the first microfeature device.

11. The method of claim 8 wherein disposing the individual electrically conductive members includes disposing a volume of solder between an individual wirebonds and an individual second intermediate bond pads.

12. The method of claim 1 wherein disposing the electrically conductive member includes disposing a volume of solder between the wirebond and the intermediate bond pad.

13. The method of claim 8 wherein disposing the individual electrically conductive members includes disposing a volume of solder between an individual first intermediate bond pad and an individual second intermediate bond pads.

14. A method for forming a microfeature device package, comprising:
coupling a wirebond between a package connection site and a first bond pad of a first microfeature device;
positioning a second microfeature device at least proximate to the first microfeature device, wherein the second microfeature device includes a second bond pad and an intermediate bond pad electrically connected to the second bond pad, and wherein the second bond pad and the intermediate bond pad face the first microfeature device; and
disposing an electrically conductive member between the first bond pad and the intermediate bond pad.

15. The method of claim 14 wherein disposing the electrically conductive member includes disposing a metal bump between the first bond pad and the intermediate bond pad.

16. The method of claim 14 wherein coupling the wirebond includes bonding a metal wire to the first bond pad, and wherein disposing an electrically conductive member includes disposing a volume of solder on the intermediate bond pad.

17. The method of claim 14 further comprising:
encapsulating the first microfeature device with an encapsulant; and
partially encapsulating the second microfeature device with the encapsulant such that a surface of the second microfeature device is exposed, wherein the surface faces away from the first microfeature device.

18. The method of claim 17 wherein the surface of the second microfeature device is configured to dissipate heat produced by the first microfeature device and/or the second microfeature device during operation.

19. The method of claim 1 further comprising aligning a surface of the first bond pad with a surface of the intermediate bond pad.

20. The method of claim 19 wherein disposing the electrically conductive member includes disposing a volume of solder between the surface of the first bond pad and the surface of the intermediate bond pad.

Assignees

• Micron Technology Inc

Inventors

• Heng Mung Suan
• Tan Kok Chua
• Leong Vince Chan Seng
• Johnson Mark S

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/752

  between stacked chips · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/722

  between stacked chips · CPC title

• H10W90/721

  of bump connectors · CPC title