3-D IC in Embedded Die Substrate
US-2024203892-A1 · Jun 20, 2024 · US
Electricity
Electricity · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01L2224/04026 |
| Official title | — |
| Display label | Electricity (mapped technology topic) |
| Total patents | 524 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 63 |
| 2016 | 62 |
| 2017 | 71 |
| 2018 | 53 |
| 2019 | 65 |
| 2020 | 68 |
| 2021 | 34 |
| 2022 | 29 |
| 2023 | 25 |
| 2024 | 31 |
| 2025 | 18 |
| 2026 | 5 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Method for manufacturing a semiconductor device having multiple heat sinks
US-9224711-B2 · Dec 29, 2015 · US
Wafer level chip scale package with exposed thick bottom metal
US-9224679-B2 · Dec 29, 2015 · US
Semiconductor device and method for producing the same
US-9224665-B2 · Dec 29, 2015 · US
Methods of fabricating wafer-level flip chip device packages
US-9214615-B2 · Dec 15, 2015 · US
Methods for producing a bond and a semiconductor module
US-9202800-B2 · Dec 1, 2015 · US
Electronic components assembly
US-9204530-B2 · Dec 1, 2015 · US
Chip device packages and fabrication methods thereof
US-9196571-B2 · Nov 24, 2015 · US
Preform including a groove extending to an edge of the preform
US-9190384-B2 · Nov 17, 2015 · US
Semiconductor device and method for producing semiconductor device
US-2015325538-A1 · Nov 12, 2015 · US
Method for manufacturing semiconductor apparatus
US-9177938-B2 · Nov 3, 2015 · US
Semiconductor device
US-9171817-B2 · Oct 27, 2015 · US
Package structure and the method to manufacture thereof
US-9171818-B2 · Oct 27, 2015 · US
Semiconductor unit and semiconductor device using the same
US-9165871-B2 · Oct 20, 2015 · US
Method for separating a plurality of dies and a processing device for separating a plurality of dies
US-9165895-B2 · Oct 20, 2015 · US
Circuit substrate and display device
US-9164342-B2 · Oct 20, 2015 · US
Electronic device comprising at least a chip enclosed in a package and a corresponding assembly process
US-9159652-B2 · Oct 13, 2015 · US
Semiconductor device for preventing a progression of a crack in a solder layer and method of manufacturing the same
US-9153519-B2 · Oct 6, 2015 · US
Semiconductor device
US-9153525-B2 · Oct 6, 2015 · US
Module including a discrete device mounted on a DCB substrate
US-9147637-B2 · Sep 29, 2015 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H01L2224/04026?
- CPC H01L2224/04026 is the Cooperative Patent Classification code for “Electricity.”
- How many patents are filed under CPC H01L2224/04026 (Electricity)?
- Our database includes 524 publications tagged with this CPC code.
- Is patent activity under CPC H01L2224/04026 growing?
- Publication counts under this code: 31 in 2024 vs 18 in 2025 (latest complete years).