Wafer level chip scale package with exposed thick bottom metal

Patent metadata

Field	Value
Publication number	US-9224679-B2
Application number	US-201414480598-A
Country	US
Kind code	B2
Filing date	Sep 8, 2014
Priority date	Aug 9, 2011
Publication date	Dec 29, 2015
Grant date	Dec 29, 2015

Abstract

A method for forming a wafer level chip scale (WLCS) package device with a thick bottom metal comprising the step of attaching a lead frame comprising a plurality of thick bottom metals onto a back metal layer of a semiconductor wafer including a plurality of semiconductor chips having a plurality of bonding pads formed on a front surface of each chip, each thick bottom metal is aligned to a central portion of each chip; a plurality of back side cutting grooves are formed along the scribe lines and filled with a package material, the package material are cut through thus forming a plurality of singulated WLCS package devices.

First claim

The invention claimed is:

1. A wafer level chip scale (WLCS) package device comprising:
a semiconductor chip having a plurality of bonding pads formed on a front surface of the semiconductor chip, each of the plurality of bonding pads having a respective metal interconnecting structure of a plurality of metal interconnecting structures formed thereon;
a bottom metal layer covering a back surface of the semiconductor chip opposite the front surface of the semiconductor chip;
a thick bottom metal attached to the bottom metal layer through a conductive bonding layer, said thick bottom metal having a thick central portion and a thin portion extending away from the thick central portion;
a top package layer covering the front surface of the semiconductor chip and surrounding a sidewall of each of the plurality of metal interconnecting structures; and
a package body surrounding at least a bottom portion of a sidewall of the semiconductor chip and a sidewall of the thick bottom metal.

2. The WLCS package device of claim 1 , wherein the package body further surrounds the entire sidewall of the semiconductor chip and a sidewall of the top package layer.

3. The WLCS package device of claim 1 , wherein the plurality of bonding pads comprise a first bonding pad and a second bonding pad, wherein the semiconductor chip further comprises a through via aligning with the second bonding pad, wherein the through via penetrates through the semiconductor chip from the back surface to the front surface, and wherein the bottom metal layer is electrically connected to the second bonding pad through a conductive material filled in the through via.

4. The WLCS package device of claim 1 , wherein top surfaces of the plurality of metal interconnecting structures are coplanar to a surface of the top package layer.

5. The WLCS package device of claim 4 further comprising a patterned metal layer forming a plurality of metal pads disposed on the surface of the top package layer, wherein each of the plurality of metal pads is electrically connected to a respective bonding pad of the plurality of bonding pads through a respective metal interconnecting structure of the plurality of metal interconnecting structures, and wherein each of the plurality of metal pads extends over an area larger than another area of the respective metal interconnecting structure of the plurality of metal interconnecting structures.

6. The WLCS package device of claim 1 , wherein the top package layer extends over an edge of the semiconductor chip and wraps a top portion of the sidewall of the semiconductor chip adjacent to the front surface of the semiconductor chip.

7. The WLCS package device of claim 6 , wherein a portion of the top package layer wrapping the top portion of the sidewall of the semiconductor chip is thinner than a portion of the package body surrounding at least the bottom portion of the sidewall of the semiconductor chip.

Assignees

• Alpha & Omega Semiconductor

Inventors

• Xue Yan Xun

Classifications

• H10W72/0198

  batch processes · CPC title

• H10W74/15

  on active surfaces of flip-chip devices, e.g. underfills · CPC title

• H10W72/856

  Bump connectors and die-attach connectors (bumps embedded in underfills H10W74/15) · CPC title

• H10W72/944

  Dispositions of multiple bond pads · CPC title

• H10W72/9415

  relative to the surface, e.g. recessed, protruding · CPC title