Method for manufacturing an electronic component
US-11728073-B2 · Aug 15, 2023 · US
using lithography, e.g. photolithography (lithographic compositions and processing in general G03F)
using lithography, e.g. photolithography (lithographic compositions and processing in general G03F) · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01C17/003 |
| Official title | {using lithography, e.g. photolithography (lithographic compositions and processing in general G03F)} |
| Display label | using lithography, e.g. photolithography (lithographic compositions and processing in general G03F) |
| Total patents | 38 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly declining.
| Year | Patents |
|---|---|
| 2015 | 2 |
| 2016 | 6 |
| 2017 | 1 |
| 2018 | 5 |
| 2019 | 5 |
| 2020 | 1 |
| 2021 | 6 |
| 2022 | 10 |
| 2023 | 2 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Chip resistor and method of manufacturing chip resistor
US-11646136-B2 · May 9, 2023 · US
Thin film resistor (TFR) formed in an integrated circuit device using TFR cap layer(s) as an etch stop and/or hardmask
US-11508500-B2 · Nov 22, 2022 · US
Chip resistor and method of manufacturing chip resistor
US-2022319745-A1 · Oct 6, 2022 · US
Resistor geometry
US-2022293308-A1 · Sep 15, 2022 · US
Resistors for integrated circuits
US-2022293717-A1 · Sep 15, 2022 · US
Thin-film components for integrated circuits
US-2022293797-A1 · Sep 15, 2022 · US
Method for manufacturing an electronic component
US-2022199297-A1 · Jun 23, 2022 · US
Heating plate, conductive pattern sheet, vehicle, and method of manufacturing heating plate
US-2022185237-A1 · Jun 16, 2022 · US
Heating plate, conductive pattern sheet, vehicle, and method of manufacturing heating plate
US-2022185238-A1 · Jun 16, 2022 · US
Heating plate, conductive pattern sheet, vehicle, and method of manufacturing heating plate
US-11338774-B2 · May 24, 2022 · US
Thin film transistor, display panel and fabricating method thereof
US-11233153-B2 · Jan 25, 2022 · US
Modulated inductance module
US-11201007-B2 · Dec 14, 2021 · US
Method for manufacturing high-sensitivity piezoresistive sensor using multi-level structure design
US-11120930-B2 · Sep 14, 2021 · US
Thin film resistor (tfr) formed in an integrated circuit device using tfr cap layer(s) as an etch stop and/or hardmask
US-2021272725-A1 · Sep 2, 2021 · US
Thin film transistor, display panel and fabricating method thereof
US-2021202750-A1 · Jul 1, 2021 · US
Method for manufacturing high-sensitivity piezoresistive sensor using multi-level structure design
US-2021098159-A1 · Apr 1, 2021 · US
Heating plate, conductive pattern sheet, vehicle, and method of manufacturing heating plate
US-10912155-B2 · Feb 2, 2021 · US
Modulated inductance module
US-2020328022-A1 · Oct 15, 2020 · US
Power management module and method of manufacture
US-10475568-B2 · Nov 12, 2019 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H01C17/003?
- CPC H01C17/003 is the Cooperative Patent Classification code for “using lithography, e.g. photolithography (lithographic compositions and processing in general G03F).”
- How many patents are filed under CPC H01C17/003 (using lithography, e.g. photolithography (lithographic compositions and processing in general G03F))?
- Our database includes 38 publications tagged with this CPC code.
- Is patent activity under CPC H01C17/003 growing?
- Publication counts under this code: 10 in 2022 vs 2 in 2023 (latest complete years).