Heating plate, conductive pattern sheet, vehicle, and method of manufacturing heating plate

Patent metadata

Field	Value
Publication number	US-11338774-B2
Application number	US-201916393057-A
Country	US
Kind code	B2
Filing date	Apr 24, 2019
Priority date	Nov 17, 2014
Publication date	May 24, 2022
Grant date	May 24, 2022

Abstract

A heating plate includes: a pair of glass plates; a conductive pattern disposed between the pair of glass plates and defining a plurality of opening areas; and a joint layer disposed between the conductive pattern and at least one of the pair of glass plates; wherein the conductive pattern includes a plurality of connection elements that extend between two branch points to define the opening areas; and a rate of the connection elements, which are straight line segments connecting the two branch points, relative to the plurality of connection elements, is less than 20%.

First claim

The invention claimed is:

1. A heating plate that generates heat upon application of voltage thereto, the heating plate comprising:
a pair of glass plates;
a conductive pattern disposed between the pair of glass plates and including a thin conductive wire; and
a joint layer disposed between the conductive pattern and at least one of the pair of glass plates;
wherein the thin conductive wire of the conductive pattern has a first surface facing a first one of the pair of glass plates, and a second surface facing the other one of the pair of glass plate,
wherein the conductive pattern includes a pattern defining a plurality of opening areas and a plurality of connection elements that extend between two branch points to define the opening areas,
wherein an average number of the connection elements extending from one branch point is more than 3.0 and less than 4.0, and
wherein, when a width of the first surface of the thin conductive wire is represented as W 2a (μm), a width of the second surface of the thin conductive wire is represented as W 2b (μm), and a cross-sectional area of the thin conductive wire is represented as S 2a (μm 2 ), the following relationships represented (a) and (b) are satisfied
0<| W 2a −W 2b |≤10  (a), and

S 2a ≥10  (b).

2. The heating plate according to claim 1 , wherein
the conductive pattern is formed by patterning a conductive layer by etching.

3. The heating plate according to claim 1 , wherein the conductive pattern includes opening areas surrounded by four, five, six and seven connection elements, respectively, and
wherein among the opening areas included in the conductive pattern, the number of opening areas surrounded by six connection elements is predominant.

4. The heating plate according to claim 1 , wherein at least some of the plurality of connection elements have a curved shape or a polygonal line shape, when viewed in a normal direction of a plate plane of the heating plate.

5. The heating plate according to claim 1 , wherein the conductive pattern includes a plurality of the thin conductive wires, and
wherein the plurality of thin conductive wires are arranged apart from one another in a direction not in parallel with a direction in which the thin conductive wires extend.

6. The heating plate according to claim 5 , wherein the thin conductive wires adjacent in the non-parallel direction are connected by a connection wire.

7. A conductive pattern sheet used in a heating plate that generates heat upon application of voltage thereto, the conductive pattern sheet comprising:
a substrate; and
a conductive pattern disposed on the substrate and including a thin conductive wire;
wherein the thin conductive wire of the conductive pattern has a proximal surface forming a surface on the side of the substrate, and a distal surface facing the proximal surface,
wherein the conductive pattern includes a pattern defining a plurality of opening areas and a plurality of connection elements that extend between two branch points to define the opening areas,
wherein an average number of the connection elements extending from one branch point is more than 3.0 and less than 4.0, and
wherein, when a width of the distal surface of the thin conductive wire is represented as W 2c (μm), a width W 2d of the proximal surface of the thin conductive wire is represented as W 2d (μm), and a cross-sectional area of the thin conductive wire is represented as S 2b (μm 2 ), the following relationships represented (c) and (d) are satisfied
0<| W 2c −W 2d |≤10  (c), and

S 2b ≥10  (d).

8. A vehicle comprising the heating plate according to claim 1 .

Assignees

• Dainippon Printing Co Ltd

Inventors

• Suetsugu Hirotoshi
• Hirakawa Manabu
• Goishihara Satoshi
• Kinoshita Koichi
• Nakamura Hidenori
• Ohkawa Koujiro
• Matsukura Tetsuo
• Inoue Isao

Classifications

• H05B3/84 Primary

  Heating arrangements specially adapted for transparent or reflecting areas, e.g. for demisting or de-icing windows, mirrors or vehicle windshields · CPC title

• H05B2203/007

  using multiple electrically connected resistive elements or resistive zones · CPC title

• H05B2203/005

  using multiple resistive elements or resistive zones isolated from each other · CPC title

• B60S1/026 Primary

  using electrical means · CPC title

• B60S1/586

  including defroster or demisting means · CPC title