Method for modeling wafer shape, and method for manufacturing wafer
US-2026057163-A1 · Feb 26, 2026 · US
for measuring evenness · Cooperative Patent Classification (CPC)
Computing, optics, measurement, and control technologies.
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | G01B7/345 |
| Official title | {for measuring evenness} |
| Display label | for measuring evenness |
| Total patents | 23 |
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is growing.
| Year | Patents |
|---|---|
| 2016 | 3 |
| 2017 | 2 |
| 2018 | 1 |
| 2019 | 3 |
| 2020 | 4 |
| 2021 | 1 |
| 2022 | 1 |
| 2023 | 2 |
| 2024 | 3 |
| 2025 | 2 |
| 2026 | 1 |
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
US-2026057163-A1 · Feb 26, 2026 · US
US-12435964-B2 · Oct 7, 2025 · US
US-2025164230-A1 · May 22, 2025 · US
US-2024384977-A1 · Nov 21, 2024 · US
US-2024314936-A1 · Sep 19, 2024 · US
US-11906574-B2 · Feb 20, 2024 · US
US-11682595-B2 · Jun 20, 2023 · US
US-2023009784-A1 · Jan 12, 2023 · US
US-2022093476-A1 · Mar 24, 2022 · US
US-11045922-B2 · Jun 29, 2021 · US
US-10704885-B2 · Jul 7, 2020 · US
US-2020135519-A1 · Apr 30, 2020 · US
US-2020132432-A1 · Apr 30, 2020 · US
US-10539407-B2 · Jan 21, 2020 · US
US-2019178642-A1 · Jun 13, 2019 · US
US-2019143482-A1 · May 16, 2019 · US
US-10190865-B2 · Jan 29, 2019 · US
US-10132778-B2 · Nov 20, 2018 · US
US-2017292823-A1 · Oct 12, 2017 · US
US-2017211922-A1 · Jul 27, 2017 · US