Verifying end effector flatness using electrical continuity

Patent metadata

Field	Value
Publication number	US-10190865-B2
Application number	US-201615087899-A
Country	US
Kind code	B2
Filing date	Mar 31, 2016
Priority date	Jan 27, 2016
Publication date	Jan 29, 2019
Grant date	Jan 29, 2019

Abstract

Methods, kits, systems, and apparatuses, for measuring and/or verifying end effector flatness using electrical continuity are provided.

First claim

The invention claimed is:

1. A system for measuring flatness of an end effector in a semiconductor processing tool, the system comprising:
an end effector that is at least partially electrically conductive and is configured to move in a z-direction, an x-direction, and a y-direction, wherein the z-direction is in the vertical direction, the x-direction is orthogonal to the y-direction, and the x-direction and the y-direction are perpendicular to the z-direction;
a probe;
an electrical continuity detector configured to detect electrical continuity between the probe and the end effector when the probe and the end effector are in electrically conductive contact; and
a controller configured to:

move the end effector in the z-direction to cause electrically conductive contact between the end effector and the probe.

2. The system of claim 1 , wherein the controller is further configured to store a z-position of the end effector, wherein the second z-position of the end effector is a position of the end effector in the z-direction when electrical continuity first occurs between the end effector and the probe during the movement of the end effector in the z-direction.

3. The system of claim 1 , wherein the electrical continuity detector is a multimeter.

4. The system of claim 3 , wherein the controller is further configured to determine when the probe and the end effector have formed electrical continuity.

5. The system of claim 1 , wherein:
the probe is configured to be located at a first location, a second location, and a third location in the semiconductor processing tool, and
the controller is further configured to:
move the end effector downwards in a z-direction to create electrically conductive contact between the end effector and the probe when the probe is located at the first location, the second location, and the third location.

6. The system of claim 5 , wherein the electrical continuity detector is further configured to determine when the probe and the end effector have formed electrical continuity when the probe is located at the first location, the second location, and the third location.

7. The system of claim 5 , wherein the controller is further configured to determine when the probe and the end effector have formed electrical continuity when the probe is located at the first location, the second location, and the third location.

8. The system of claim 5 , wherein the controller is further configured to:
store a first z-position of the end effector, wherein the first z-position of the end effector is a position of the end effector in the z-direction when electrical continuity first occurs between the first measuring point and the probe during the movement of the end effector in the z-direction,
store a second z-position of the end effector, wherein the second z-position of the end effector is a position of the end effector in the z-direction when electrical continuity first occurs between the second measuring point and the probe during the movement of the end effector in the z-direction, and
store a third z-position of the end effector, wherein the third z-position of the end effector is a position of the end effector in the z-direction when electrical continuity first occurs between the third measuring point and the probe during the movement of the end effector in the z-direction.

9. The system of claim 5 , further comprising a jig, wherein the jig is configured to be placed in a portion of the semiconductor processing tool in which an end effector can be located and is configured to position the gauge at a first location, a second location, and a third location.

10. The system of claim 9 , wherein the jig is further configured to position the probe at one or more additional locations.

11. The system of claim 10 , wherein the jig is further configured to position the probe at a fourth location, a fifth location, a sixth location, a seventh location, and an eighth location.

12. The system of claim 11 , wherein the jig is further configured to position the probe at a ninth location and a tenth location.

13. The system of claim 1 , wherein:
the controller further comprises an input/output port, and
the electrical continuity detector is a sensor that is electrically connected to the input/output port of the controller.

14. The system of claim 1 , wherein:
the end effector is further configured to move in an x-direction and a y-direction, wherein the x-direction is orthogonal to the y-direction, and wherein the x-direction and the y-direction are perpendicular to the z-direction, and
the controller is further configured to:
move the end effector to a first position, a second position, and a third location,
move the end effector downwards in the z-direction to create electrically conductive contact between the end effector and the probe when the end effector is located at the first location, the second location, and the third location.

15. The system of claim 14 , wherein the electrical continuity detector is further configured to determine when the probe and the end effector have formed electrical continuity when the probe is located at the first location, the second location, and the third location.

16. The system of claim 14 , wherein the controller is further configured to determine when the probe and the end effector have formed electrical continuity when the probe is located at the first location, the second location, and the third location.

17. The system of claim 14 , wherein the controller is further configured to
store a first z-position of the end effector, wherein the first z-position of the end effector is a position of the end effector in the z-direction when electrical continuity first occurs between the first measuring point and the probe during the movement of the end effector in the z-direction,
store a second z-position of the end effector, wherein the second z-position of the end effector is a position of the end effector in the z-direction when electrical continuity first occurs between the second measuring point and the probe during the movement of the end effector in the z-direction, and
store a third z-position of the end effector, wherein the third z-position of the end effector is a position of the end effector in the z-direction when electrical continuity first occurs between the third measuring point and the probe during the movement of the end effector in the z-direction.

18. The system of claim 1 , further comprising:
a first electrical cable; and
a second electrical cable, wherein:
the first cable is configured to be electrically connected to the probe,
the second cable is configured to be electrically connected to a ground, and
the electrical continuity detector is configured to electrically connect with the first electrical cable and the second electrical cable.

Assignees

• Lam Res Corp

Inventors

• Aguilar Amaya Silvia Rocio
• Witkowicki Derek John
• Genetti Damon Tyrone

Classifications

• G01B7/34 Primary

  for measuring roughness or irregularity of surfaces · CPC title

• G01B7/345 Primary

  for measuring evenness · CPC title

• H10P74/27

  Structural arrangements therefor · CPC title

• H10P74/207

  Electrical properties, e.g. testing or measuring of resistance, deep levels or capacitance-voltage characteristics · CPC title

• H10P74/238 Primary

  comprising acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection or in-situ thickness measurement · CPC title