Electrolytic copper foil and preparation method therefor, negative electrode plate, secondary battery, battery module, battery pack and power consuming device

Patent metadata

Field	Value
Publication number	US-12327862-B2
Application number	US-202318334552-A
Country	US
Kind code	B2
Filing date	Jun 14, 2023
Priority date	Sep 10, 2021
Publication date	Jun 10, 2025
Grant date	Jun 10, 2025

Abstract

A method for preparing an electrolytic copper foil includes placing an anode and a cathode to be plated in a twin crystal growth agent containing electroplating solution in an electroplating tank, and, under conditions that the electroplating solution is provided with randomly alternating transitions of one or two of an ultrasonic wave at a frequency f11 and an ultrasonic wave at a frequency f12 and one or two of an ultrasonic wave at a frequency f21 and an ultrasonic wave at a frequency f22, performing direct current electroplating to obtain the electrolytic copper foil, wherein f11>40 kHz, 15 kHz<f12≤40 kHz, 0 kHz<f21≤15 kHz, and f22=0 kHz.

First claim

What is claimed is:

1. A method for preparing an electrolytic copper foil, comprising:
placing an anode and a cathode to be plated in a twin crystal growth agent containing electroplating solution in an electroplating tank, wherein the twin crystal growth agent comprises one or two of a gelatin and polyethyleneimine; and
under conditions that the electroplating solution is provided with randomly alternating transitions of one or two of an ultrasonic wave at a frequency f11 and an ultrasonic wave at a frequency f12 and one or two of an ultrasonic wave at a frequency f21 and an ultrasonic wave at a frequency f22, performing direct current electroplating to obtain the electrolytic copper foil, wherein 40 kHz<f11≤100 kHz, 15 kHz<f12≤40 kHz, 0 kHz<f21≤15 kHz, and f22=0 kHz;
wherein during the electroplating to obtain the electrolytic copper foil:
a percentage of a total time for electroplating under conditions of the ultrasonic wave at the frequency f11 and the ultrasonic wave at the frequency f12 is 70%-90%, and a percentage of a total time for electroplating under conditions of the ultrasonic wave at the frequency f21 and the ultrasonic wave at the frequency f22 is 10%-30%; and
a number of ultrasonic transitions is 2 or more, and a number of ultrasonic transitions per minute is less than or equal to 25.

2. The method according to claim 1 , wherein during the electroplating to obtain the electrolytic copper foil:
the percentage of the total time for electroplating under conditions of the ultrasonic wave at the frequency f11 and the ultrasonic wave at the frequency f12 75%-85%, and the percentage of the total time for electroplating under conditions of the ultrasonic wave at the frequency f21 and the ultrasonic wave at the frequency f22 15%-25%.

3. The method according to claim 1 , wherein during the electroplating to obtain the electrolytic copper foil:
a percentage of a time for electroplating under conditions of the ultrasonic wave at the frequency f11 is 40%-90%; and/or
a percentage of a time for electroplating under conditions of the ultrasonic wave at the frequency f12 is 0-50%; and/or
a percentage of a time for electroplating under conditions of the ultrasonic wave at the frequency f21 is 0-30%; and/or
a percentage of a time for electroplating under conditions of the ultrasonic wave at the frequency f22 is 0-10%.

4. The method according to claim 1 , wherein the direct current electroplating is carried out at a current density of 2 A/dm 2 -80 A/dm 2 .

5. The method according to claim 1 , wherein;
the electroplating solution is a sulfuric acid-copper sulfate electroplating solution, and the electroplating solution further comprises copper ions, sulfuric acid, and chloride ions;
a concentration of the copper ions in the electroplating solution is 50 g/L-100 g/L;
a concentration of the sulfuric acid in the electroplating solution is 40 g/L-70 g/L;
a mass concentration of the chloride ions in the electroplating solution is 20 ppm-50 ppm;
a mass concentration of the twin crystal growth agent in the electroplating solution is 50 ppm-110 ppm.

6. The method according to claim 1 , wherein:
the electroplating solution further comprises a leveling agent and a brightening agent;
the leveling agent comprises polypeptide protein, and the brightening agent comprises one or more of sodium polydithiodipropane sulfonate, and sodium 3-mercaptopropane sulfonate;
a concentration of the leveling agent in the electroplating solution is 20 ml/L-40 ml/L;
a concentration of the brightening agent in the electroplating solution is 10 ml/L-30 ml/L.

Assignees

• Contemporary Amperex Technology Hong Kong Ltd

Inventors

• Wu Yukun
• Ge Xiaoming

Classifications

• H01M4/0404

  by coating on electrode collectors · CPC title

• H01M4/661

  Metal or alloys, e.g. alloy coatings (H01M4/669 take precedence) · CPC title

• H01M4/0452

  from solutions · CPC title

• C30B30/06

  using mechanical vibrations · CPC title

• C30B7/12

  by electrolysis · CPC title