Anodizing method and manufacturing method for an anisotropic conductive member

Patent metadata

Field	Value
Publication number	US-2021363653-A1
Application number	US-202117395653-A
Country	US
Kind code	A1
Filing date	Aug 6, 2021
Priority date	Feb 15, 2019
Publication date	Nov 25, 2021
Grant date	—

Abstract

There are provided an anodizing method by which straight micropores can be formed and a manufacturing method for an anisotropic conductive member in which a filling defect of a conductive material is suppressed. The anodizing method is a method including subjecting a surface of a valve metal plate to a plurality of times of anodization and forming an anodized film having micropores present in a thickness direction of the valve metal plate and having a barrier layer present in the bottom part of the micropores, on the surface of the valve metal plate. In steps of second and subsequent times of anodization of the plurality of times of anodization, a current increasing period and a current keeping period are continuous. The current increasing period is a period in which a quantity of current increase is more than 0 amperes per square meter per second and 0.2 amperes per square meter per second or less, and which is 10 minutes or less. A current is kept at a constant value during a current keeping period, and the constant value is equal to or less than a maximum current value during the current increasing period.

First claim

What is claimed is:

1 . An anodizing method comprising:
subjecting a surface of a valve metal plate to a plurality of times of anodization; and forming an anodized film having micropores present in a thickness direction of the valve metal plate and having a barrier layer present in a bottom part of the micropores, on the surface of the valve metal plate, wherein in steps of second and subsequent times of anodization of the plurality of times of anodization, a current increasing period and a current keeping period are continuous, the current increasing period is a period in which a quantity of current increase is more than 0 amperes per square meter per second and 0.2 amperes per square meter per second or less, and which is 10 minutes or less, and a current is kept at a constant value during the current keeping period, and the constant value is equal to or less than a maximum current value during the current increasing period.

2 . The anodizing method according to claim 1 ,
wherein a voltage that is applied to the valve metal plate is increased stepwise during the current increasing period.

3 . The anodizing method according to claim 1 ,
wherein a counter electrode is arranged to face the valve metal plate, and a conductive load member is electrically connected in parallel with the valve metal plate.

4 . The anodizing method according to claim 1 ,
wherein a step of a first time of anodization of the plurality of times of anodization is carried out at a constant voltage.

5 . The anodizing method according to claim 1 ,
wherein the valve metal plate is an aluminum substrate.

6 . A manufacturing method for an anisotropic conductive member, comprising:
a step of filling micropores of an anodized film with a conductive material, the anodized film having the micropores and being obtained by the anodizing method according to claim 1 .

7 . The manufacturing method for an anisotropic conductive member according to claim 6 , further comprising:
a step of removing a valve metal plate from the anodized film before the step of filling the micropores of the anodized film with a conductive material; and a step of piercing the micropores present in the anodized film from which the valve metal plate has been removed.

8 . The anodizing method according to claim 2 ,
wherein a step of a first time of anodization of the plurality of times of anodization is carried out at a constant voltage.

9 . The anodizing method according to claim 2 ,
wherein the valve metal plate is an aluminum substrate.

10 . A manufacturing method for an anisotropic conductive member, comprising:
a step of filling micropores of an anodized film with a conductive material, the anodized film having the micropores and being obtained by the anodizing method according to claim 2 .

11 . The manufacturing method for an anisotropic conductive member according to claim 10 , further comprising:
a step of removing a valve metal plate from the anodized film before the step of filling the micropores of the anodized film with a conductive material; and a step of piercing the micropores present in the anodized film from which the valve metal plate has been removed.

12 . The anodizing method according to claim 3 ,
wherein a step of a first time of anodization of the plurality of times of anodization is carried out at a constant voltage.

13 . The anodizing method according to claim 3 ,
wherein the valve metal plate is an aluminum substrate.

14 . A manufacturing method for an anisotropic conductive member, comprising:
a step of filling micropores of an anodized film with a conductive material, the anodized film having the micropores and being obtained by the anodizing method according to claim 3 .

15 . The manufacturing method for an anisotropic conductive member according to claim 14 , further comprising:
a step of removing a valve metal plate from the anodized film before the step of filling the micropores of the anodized film with a conductive material; and a step of piercing the micropores present in the anodized film from which the valve metal plate has been removed.

16 . The anodizing method according to claim 4 ,
wherein the valve metal plate is an aluminum substrate.

17 . A manufacturing method for an anisotropic conductive member, comprising:
a step of filling micropores of an anodized film with a conductive material, the anodized film having the micropores and being obtained by the anodizing method according to claim 4 .

18 . The manufacturing method for an anisotropic conductive member according to claim 17 , further comprising:
a step of removing a valve metal plate from the anodized film before the step of filling the micropores of the anodized film with a conductive material; and a step of piercing the micropores present in the anodized film from which the valve metal plate has been removed.

19 . A manufacturing method for an anisotropic conductive member, comprising:
a step of filling micropores of an anodized film with a conductive material, the anodized film having the micropores and being obtained by the anodizing method according to claim 5 .

20 . The manufacturing method for an anisotropic conductive member according to claim 19 , further comprising:
a step of removing a valve metal plate from the anodized film before the step of filling the micropores of the anodized film with a conductive material; and a step of piercing the micropores present in the anodized film from which the valve metal plate has been removed.

Assignees

• Fujifilm Corp

Inventors

• Hotta Yoshinori
• Kurooka Shunji

Classifications

• H10W70/095

  of vias therein · CPC title

• H10W90/701

  characterised by the relative positions of pads or connectors relative to package parts · CPC title

• H10W70/635

  Through-vias · CPC title

• C25D11/18

  After-treatment, e.g. pore-sealing · CPC title

• C25D5/18

  Electroplating using modulated, pulsed or reversing current · CPC title