Selection method and system for target palladium membrane, execution method and system for hydrogen-related reaction, and determination method and system for permeation rate
US-2026021453-A1 · Jan 22, 2026 · US
containing more than 50% by weight of platinum group metals
containing more than 50% by weight of platinum group metals · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C25D3/567 |
| Official title | {containing more than 50% by weight of platinum group metals} |
| Display label | containing more than 50% by weight of platinum group metals |
| Total patents | 57 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 3 |
| 2016 | 6 |
| 2017 | 6 |
| 2018 | 3 |
| 2019 | 9 |
| 2020 | 6 |
| 2021 | 4 |
| 2022 | 2 |
| 2023 | 9 |
| 2024 | 6 |
| 2025 | 2 |
| 2026 | 1 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Catalyst for hydrogen evolution reaction containing ruthenium-based alloy, water electrolysis electrode containing the same, and method of manufacturing the same
US-2025250698-A1 · Aug 7, 2025 · US
Leveling agent, composition, and application thereof
US-2025215598-A1 · Jul 3, 2025 · US
Method of forming a Pd—Au alloy layer on a substrate
US-12168199-B2 · Dec 17, 2024 · US
Photoelectrode and preparation method therefor, and platinum-based alloy catalyst and preparation method therefor
US-12146231-B2 · Nov 19, 2024 · US
Coating Structure Comprising Graphite Alloy and Preparation Method
US-2024191387-A1 · Jun 13, 2024 · US
Filtration filter
US-11986757-B2 · May 21, 2024 · US
Bonding wire for semiconductor devices
US-11929343-B2 · Mar 12, 2024 · US
Method of producing an aperture plate for a nebulizer
US-2024001048-A1 · Jan 4, 2024 · US
Bonding wire for semiconductor devices
US-2023387066-A1 · Nov 30, 2023 · US
Photoelectrode and preparation method therefor, and platinum-based alloy catalyst and preparation method therefor
US-2023313394-A1 · Oct 5, 2023 · US
Bonding wire for semiconductor devices
US-11721660-B2 · Aug 8, 2023 · US
Bonding wire for semiconductor devices
US-2023245995-A1 · Aug 3, 2023 · US
Bonding wire for semiconductor devices
US-2023215834-A1 · Jul 6, 2023 · US
Aperture plate for a nebulizer
US-11679209-B2 · Jun 20, 2023 · US
Electrodeposited platinum-gold alloy
US-11674234-B1 · Jun 13, 2023 · US
Nanowire having ruthenium nanowire within a silica nanotube
US-11618962-B2 · Apr 4, 2023 · US
Pulsed electrochemical deposition of ordered intermetallic carbon composites
US-2023006218-A1 · Jan 5, 2023 · US
Method of forming a pd-au alloy layer on a substrate
US-2022403541-A1 · Dec 22, 2022 · US
Metal or metal alloy deposition composition and plating compound
US-11512405-B2 · Nov 29, 2022 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C25D3/567?
- CPC C25D3/567 is the Cooperative Patent Classification code for “containing more than 50% by weight of platinum group metals.”
- How many patents are filed under CPC C25D3/567 (containing more than 50% by weight of platinum group metals)?
- Our database includes 57 publications tagged with this CPC code.
- Is patent activity under CPC C25D3/567 growing?
- Publication counts under this code: 6 in 2024 vs 2 in 2025 (latest complete years).